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Oculus Buys Pepple
July 27, 2015 by admin
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Facebook’s Oculus unit announcd that it has agreed to acquire Israeli gesture recognition technology developer Pebbles Interfaces for an undisclosed amount.
The announcement was made in a blog posted by Oculus.
Israel’s Calcalist financial news website said the deal was worth tens of millions of dollars.
While other companies pioneering the virtual reality field focus on full-body movement, Pebbles’ technology detects and tracks hand movement. It is aimed primarily at gamers but also has applications for TV, computers, or smartphone operation while driving.
Recently Pebbles integrated its technology with Oculus glasses, which translate finger gestures into virtual movement through a camera mounted on the glass frame, Calcalist said.
Investors in Pebbles include Chinese mobile phone maker Xiaomi, Israeli venture capital fund Giza and U.S. storage firm SanDisk, Calcalist said.
Toshiba And SanDisk Launch 3D Flash Chip
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Toshiba has announced the world’s first 48-layer Bit Cost Scalable (BiCS) flash memory chip.
The BiCS is a two-bit-per-cell, 128Gb (16GB) device with a 3D-stacked cell structure flash that improves density and significantly reduces the overall size of the chip.
Toshiba is already using 15nm dies so, despite the layering, the finished product will be competitively thin.
24 hours after the first announcement, SanDisk made one of its own regarding the announcement. The two companies share a fabrication plant and usually make such announcements in close succession.
“We are very pleased to announce our second-generation 3D NAND, which is a 48-layer architecture developed with our partner Toshiba,” said Dr Siva Sivaram, executive vice president of memory technology at SanDisk.
“We used our first generation 3D NAND technology as a learning vehicle, enabling us to develop our commercial second-generation 3D NAND, which we believe will deliver compelling storage solutions for our customers.”
Samsung has been working on its own 3D stacked memory for some time and has released a number of iterations. Production began last May, following a 10-year research cycle.
Moving away from the more traditional design process, the BiCS uses a ‘charge trap’ which stops electrons leaking between layers, improving the reliability of the product.
The chips are aimed primarily at the solid state drive market, as the 48-layer stacking process is said to enhance reliability, write speed and read/write endurance. However, the BiCS is said to be adaptable to a number of other uses.
All storage manufacturers are facing a move to 3D because, unless you want your flash drives very long and flat, real estate on chips is getting more expensive per square inch than a bedsit in Soho.
Micron has been talking in terms of 3D NAND since an interview with The INQUIRER in 2013 and, after signing a deal with Intel, has predicted 10TB in a 2mm chip by the end of this year.
Production of the chips will roll out initially from Fab 5 before moving in early 2016 to Fab 2 at the firm’s Yokkaichi Operations plant.
This is in stark contrast to Intel, which mothballed its Fab 42 chip fabrication plant in Chandler, Arizona before it even opened, as the semiconductors for computers it was due to produce have fallen in demand by such a degree.
The Toshiba and Sandisk BiCS chips are available for sampling from today.
New USB Chip Developed
October 18, 2013 by admin
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Silicon Motion says it has begun shipping samples of a new USB 3.0 controller chip for flash drives that could boost performance by up to 50%.
The company said the new SM3267 integrated controller is expected to deliver up to 160MB/s read, and 60MB/s write speeds through a single channel; that would be a 30% to 50% performance improvement over today’s USB 3.0 flash drive technology.
Even though the USB 3.0 specification has the capability to support 4.8Gbps throughput speeds, the speed of a USB 3.0-enabled flash drive is dictated by the speed of the accessing flash devices in the drive. Today, most consumer-USB 3.0 flash drives support about 100MB/s read speeds.
We are pleased to announce that SM3267 has received design-ins from most of our current USB controller customers, including many top-tier OEMs, and we expect SM3267-based USB 3.0 flash drives will be commercially available starting in the fourth quarter of 2013,” Wallace Kou, CEO of Silicon Motion, said in a statement.
The new integrated chip will also be able to run at lower voltages, from 5 volts to 1.2 volts, enabling a 25% to 30% lower USB flash drive device temperature compared with other USB 3.0 flash controller products in the market, Silicon Motion said.
The new IC will support the vast majority of NAND flash technology, including new triple-level cell (TLC), multi-level cell (MLC), high speed Toggle, and ONFI DDR NAND manufactured by Samsung, Toshiba, SanDisk, SK Hynix, Micron and Intel.
The new chip has already passed both USB-IF compliance testing and WHCK (Windows Hardware Certification Kit) tests for Windows 7 and Windows 8.
The new IC is available in a Chip-on-Board (COB) and in a 48-pin QFN green package.
SanDisk Debuts Wireless Flash Drive
August 5, 2013 by admin
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SanDisk on Monday announced a line of wireless flash drives that can hold up to 64GB of data.
The new drives include the Connect Wireless Flash Drive — a thumb drive — and the Connect Wireless Media Drive, a larger, but still pocket-sized storage device. The Connect Wireless Flash Drive comes in 16GB and 32GB capacities; the Connect Wireless Media Drive comes in 32GB and 64GB capacities.
The Connect Wireless Flash drive is 3.07-in. x 1.04-in. x 0.54-in. The Connect Wireless Media Drive is 2.6-in. x 2.6-in. x 0.52-in.
The Connect Wireless drive family allows users to not only store but share and stream files across multiple mobile devices. They offer up to eight simultaneous device connections and three media streams, and support separate streams of 720p video content at 2MB/sec to three or five devices concurrently (for the Flash Drive and Media Drive, respectively).
According to a SanDisk spokesman, video streaming performance isn’t affected by multiple streams because device limits are set at a point that supports the streams without degradation. Devices can connect to the drives up to 150 feet away.
The Connect Wireless drives work with all iOS and Android devices, and Kindle Fire tablets, as well as PC and Mac computers. The drives are compatible with Windows 8, Windows 7, Windows Vista, Windows XP and Mac OS 10.6 or higher
Movies, music, photos and documents can be loaded onto the wireless drives by simply dragging and dropping the files, which can then be accessed via the SanDisk Connect apps. Those apps are available for download from the App Store, Google Play Store and the Amazon Appstore for Android.
The drives contain an internal router, so no external router or Internet connection is needed to stream media. In order to use the drives, mobile device users simply download SanDisk’s Connect App.
The drives run on lithium-ion batteries. A single charge provides up to four hours of wireless streaming, with streaming data protected by Wi-Fi Password Protection (WPA2).
“With the new SanDisk Connect product line, we’re raising the bar on what consumers can expect from personal storage,” said Dinesh Bahal, vice president for product marketing for SanDisk.
The SanDisk Connect Wireless Flash Drive is available in 16GB or 32GB capacities for $49.99 and $59.99, respectively. In the U.S., it is available for preorder on Amazon.com, Newegg.com and Micro Center, with availability at Best Buy starting in August. It will also be available for preorder on Amazon.com in Germany and UK.
The SanDisk Connect Wireless Media Drive has a retail price of $79.99 for 32GB or $99.99 for 64GB storage capacity. It is available for preorder in the U.S. on Amazon.com, with availability in Germany and UK in the fourth quarter of 2013.
Toshiba To Offer A 20-megapixel Image Chip
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Toshiba is gearing up for to offer a 20-megapixel image sensor for digital cameras that it says will be the highest resolution of its kind.
The Tokyo-based firm said the new chips will be able to support capturing 30 frames per second at full resolution. They will also be able to shoot video at 60 frames per second at 1080P or 100 frames at 720P.
Toshiba said it will begin shipping samples of the new CMOS chips in January, with mass production to begin in August of 300,000 units monthly. Toshiba is best known in components for its NAND flash memory, which it develops with partner SanDisk, but is also a major manufacturer of LSI and other semiconductors.
Digital point-and-shoot cameras are steadily falling in price, squeezed between brutal competition among manufacturers and the increasing threat of smartphones and mobile devices. While the number of pixels a camera can capture is not always a direct measure of the overall quality of its images, it is a key selling point to consumers.
The image resolution of top-end smartphones now often meets or exceed that of digital cameras. The Nokia 808 PureView launched earlier this year has a 41-megapixel image sensor.
The Japanese manufacturer said it has increased the amount of information pixels in the new chip can store compared to its previous generation of CMOS, producing better overall images. It has also reduces the size of pixels – the new 20-megapixel version has individual pixels that measure 1.2 micrometers, down from 1.34 micrometers in its 16-megapixel product.
SanDisk Hurt By Weak Demand, Supply Glut
April 10, 2012 by admin
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Flash-memory maker SanDisk Corp warned that tepid demand from mobile phone manufacturers and a glut in supply that has led to lower prices are putting a dent its revenue margins.
The maker of NAND chips — used as storage memory in smartphones and tablets — has recently seen demand taper with some of its key customers scaling back orders.
Smartphones and tablets have caused a boom in NAND production, but SanDisk’s customers have not all done equally well from the explosion in mobile gadgets.
“Anybody who is not a Samsung or an Apple is burning through some (mobile) handset inventory,” RBC Capital Markets analyst Doug Freedman said.
“Until we get the PC market, tablet market and handset market back buying, we’ll see an oversupply situation.”
SanDisk’s weak outlook mirrors warnings from rival flash-memory makers, who have also blamed weak prices and demand for their disappointing results.
Late last month, Micron Technology said it was facing persistently low prices for memory chips and posted a wider loss. Toshiba Corp, Japan’s biggest chip maker, also posted a drop in quarterly sales at its electronics devices business, which includes semiconductors, hit by lower prices for memory chips.
SanDisk in January expressed concerns about weaker demand weighing on sales in the first half of this year and forecast lower-than-expected revenue for the first quarter.
The Milpitas, California-based company, which is set to report results later this month, said its gross margins for the January-March quarter will come in below its prior expectations of 39-42 percent, hurt by lower prices for its chips.
New MacBook Includes Faster NAND Chip
The soon to be released new version of Apple’s MacBook Air, will feature NAND flash memory with up to 400Mbps performance, about one and a half times faster than its current technology, according to a recent report.
Unlike many notebooks, the MacBook Air has no hard drive or optical drive and instead uses a slim flash board for its internal mass storage device.
Citing an “Asian electronics component company person,” the blog site Macotakara stated that Apple will use flash memory chips that includes the new Double Data Rate (DDR) 2.0 interface. While the rumors could not be confirmed, the upgrade would come as no surprise, since Apple’s next MacBook Air, which originally used Toshiba’s Blade X-gale NAND flash board, has moved to using Samsung’s flash memory. The MacBook Air’s current Samsung flash sports read rates of 261Mbps and write rates of up to 209Mbps and is based on DDR 1.0 technology.
DDR 2.0 provides a tenfold increase over the 40Mbps Single Data Rate (SDR) NAND flash in widespread use today.
In May, Samsung announced that it was producing DDR 2.0 multilevel cell flash chips. Samsung’s flash chips are made using its smallest circuitry, only 20 nanometers wide. The chips boast a performance improvement of three times over its previous technology.
DDR NAND flash comes in two forms: Toggle Mode from Samsung and Toshiba; and ONFI NAND, from the Open NAND Flash Interface (ONFI) working group. The ONFI protocol is used by flash manufacturers, including Intel, Micron, SanDisk, Hynix and Spansion. In March, the ONFI working group announced its 3.0 specification for the DDR 2.0 interface, which also has up to 400Mbps throughput but with only half the number of pins, for a significant reduction in size.
DRAM Prices Going Up
iSuppli is reporting that global chip revenue should increase to $325.2 due to supply and demand. Two months ago iSuppli originally forecasted a 5.8 percent increase to $320.1 billion. Apparently, DRAM chips will be impacted the most with a price increase due to supply issues as a result of the recent earthquake in Japan. iSuppli had originally forecasted sales of DRAM chips to shrink by four percent this year instead of seeing a drop of 10.6 percent.