Is Electricity In TSMC’s Future?
Contract chip-maker Taiwan Semiconductor Manufacturing Company (TSMC) is thinking of generating electricity in-house.
The cunning plan is to install electric generating equipment at its factories or even building its own power plant.
Apparently, the company’s electricity bill will go up by 50 per cent over the next ten years as it moves to more-advanced technologies.
Taiwan is already facing power shortage problems and TSMC is worried that its plans could be stuffed up.
TSMC has asked Taiwan’s Ministry of Economic Affairs (MOEA) and government-owned Taiwan Power Company (Taipower) about the feasibility of building its own power generators and related regulatory matters.
According to Digitimes companies can set up power generating equipment for use at their own factory sites, but the law has to be revised to allow TSMC to build its own power plant.
TSMC previously pointed out that it does not necessarily need nuclear power unless there is an alternative. We really hope that quote does not mean that TSMC is considering going nuclear.
Source-http://www.thegurureview.net/computing-category/is-electricity-in-tsmcs-future.html
Both AMD And nVidia Preparing For 14nm
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AMD and Nvidia both appear to be certain to get their “14 nm” out next year.
According to TweakTown Nvidia is apparently dotting the “I” and working out where to put in the semi-colons for its Pascal GPU using TSMC’s 16nm FinFet node. AMD rumored has been wining and dining its old chums at GlobalFoundries to use its 14nm process for its Greenland GPU.
Although these sound like different technologies the “14nm and 16nm” is difference how you measure a transistor. The outcome of both 14 and 16 should be a fairly same sized transistor with similar power features. TSMC calls its process 16nm FinFet, while Samsung and GloFo insist on calling it 14nm FinFet.
The dark satanic rumor mill suggests that the Greenland GPU, which has new Arctic Islands family micro-architecture, will have HBM2 memory. There will be up to 32GB of memory available for enthusiast and professional users. Consumer-oriented cards will have eight to 16GB of HBM2 memory. It will also have a new ISA (instruction set architecture).
It makes sense, AMD moved to HBM with its Fury line this year. Nvidia is expected to follow suit in 2016 with cards offering up to 32GB HBM2 as well.
Both Nvidia and AMD are drawn to FinFET which offers 90 percent more density than 28nm. Both will boost the transistors on offer with their next-generation GPUs, with 17 to 18 billion transistors currently being rumored.
Source- http://www.thegurureview.net/computing-category/are-both-amd-and-nvidia-readying-to-release-a-14nm-gpu.html
AMD’s Quantum Has Intel Inside
AMD’s Project Quantum PC system, with graphics powered by two of the new Fiji GPUs may have got the pundits moist but it has been discovered that the beast has Intel inside
KitGuru confirmed that the powerful tiny system, as shown at AMD’s own event, was based upon an Asrock Z97E-ITX/ac motherboard with an Intel Core i7-4790K ‘Devil’s Canyon’ processor.
Now AMD has made a statement to explain why it chose to employ a CPU from one of its competitor in what is a flagship pioneering gaming PC.
It told Tom’s Hardware that users wanted the Devil’s Canyon chip in the Project Quantum machine.
Customers “want to pick and choose the balance of components that they want,” and the machine shown off at the E3 was considered to be the height of tech sexiness right now.
AMD said Quantum PCs will feature both AMD and Intel CPUs to address the entire market, but did you see that nice Radeon Fury… think about that right now.
IT is going to be ages before we see the first Project Quantum PCs will be released and the CPU options might change. We would have thought that AMD might want to put its FinFET process ZEN CPUs in Project Quantum with up to 16 cores and 32 threads. We will not see that until next year.
Is Samsung The King Of LTE?
June 24, 2015 by admin
Filed under Network Services
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Samsung Electronics has told the world that owns the largest number of patent rights essential for long-term evolution (LTE) technology in the world.
Writing in its official blog “Samsung Tomorrow” that it has more than 3,600 standard essential patents (SEP) for the LTE and LTE-Advanced (LTE-A) technology. That is 17 percent of all LTE-related SEPs.
We guess this means that if someone buys an LTE phone more than 17 per cent of the money which goes to buy patents should end up in Samsung’s bank account.
Samsung Electronics Digital Media & Communication Laboratory’s intellectual property application team head Lee Heung-mo said Samsung Electronics has established a solid foothold as the global leader and the first mover in the fourth-generation mobile telecom market.
“This also means that the company has become able to provide more convenience to customers by developing the latest technologies.”
The Taiwanese patent office conducted market research for the nation’s state-run National Applied Research Laboratory based on about 6,000 patent rights listed at the Patent and Trademark Office in the United States during the last two years.
LG Electronics and Qualcomm followed Samsung Electronics in second place with 14 percent of SEPs, each. Ericsson, Panasonic, Nokia and NTT DoCoMo hold the third spot with 5 percent, each.
Pantech, the nation’s third-largest handset maker which currently faces bankruptcy, held only one percent, while Korea’s state-run Electronics and Telecommunications Research Institute owned less than 1 percent, the report showed.
During the patent dispute with Apple, the U.S. International Trade Commission said Apple had infringed on Samsung Electronics’ SEPs though they had to be shared under a “fair, reasonable and non-discriminatory” principle.
Samsung Electronics said it has pushed for securing the SEPs in this sector during the last 18 years and has competed with global telecom giants including Qualcomm, Nokia and Ericsson as a relative latecomer. It said securing leadership in SEPs may change the crisis of facing patent disputes to diversifying income sources.
MediaTek Debuts Contactless Heart Rate Monitor
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While MediaTek might be known for its multi-core smartphone processors, the firm was very keen to show off its more adventurous side at Computex 2015.
With a booth almost entirely dedicated to the latest and greatest from its new Labs division, which aims to bring the latest innovations from developers to market, MediaTek offered something a little more unexpected compared to previous years.
Launched in autumn last year, MediaTek Labs is a worldwide initiative to help developers of any background or skill level to create and market wearable and Internet of Things (IoT) devices.
With the firm’s LinkIt Development Platform, based on the MediaTek Aster (MT2502) chipset, sitting at its core, the Labs programme provides developers, makers and service providers with both software and hardware development kits, technical documentation and business support.
Here’s a few of our favourite innovations showed off at Computex, based on either the LinkIt One platform, or the firm’s fresh Helio P10 smartphone family of SoCs.
Heart rate monitoring smartphone camera
This “contactless heartrate monitoring” technology is powered by the firm’s Visual Processing Application in its latest P10 smartphone SoC.
It makes use of a smartphone’s video camera to take a heart rate reading via the front-facing camera by stripping down the layers of the image taken by the camera in real-time to detect the pulse in a user’s temple.
We were rather dubious about how well this might work, so gave it a go. While it took a good few seconds to match up, you can see from the photo that it is almost as accurate as the portable ECG monitoring device we had clipped on our finger. Impressive stuff.
Wine brewer
Winning first prize in the ITRI Mobilehero competition in Taiwan last year, this nifty IoT wine brewing device was developed by a local start-up called Alchema.
It consists of five sensors thatmonitor the alcohol content and the brewing environment. The results we tasted were, shall we say, interesting, if a little on the sharp side.
Alchema looking to raise more funds on Kickstarter before the end of the year.
Another LinkIt-powered device MediaTek showed off at Computex was a wearable aimed for the elderly. Using Bluetooth and accelerometer sensors, the wristband tracker detects the users’ wrist motions and raises an alarm, alerting those that are linked to the watch via a smartphone app if their elderly family member, loved one or friend’s device has detected a sudden movement that could resemble a fall or accident.
Sitting at the more mature end of the LinkIt developer platform spectrum, but still less than a year old, is an electric-scooter rental company called Skuro Moto. We spoke to its chief executive Frank Chen, who is running the company at the tender age of 24 after developing the idea while at university.
Skuro works with electric-vehicle maker Ahamani EV Technology to provide a rental service at Yuan Ze University in Taiwan. The bikes reduce costs for riders by about 30 percent thanks to a monitoring system enabled by the LinkIt chip that lets riders see their power usage. They can also be started by a swipe of a student identity card, to save the trouble of lost keys.
TSMC Moving To 16FF+ Soon
TSMC’s 16nm FinFET process has barely gotten off the ground, but the foundry is already talking about 16nm FinFET Plus, which is due to launch by the end of the year.
The improved 16nm FinFET Plus (16FF+) node is supposed to deliver more efficiency and performance, making TSMC’s node more competitive compared to Samsung’s 14nm node. That is the general idea, but TSMC’s first generation 16nm node has failed to impress in terms of design wins.
TSMC president CC Wei said the new 16FF+ node already has 20 tapeouts, ten of which achieved satisfactory yield performance. Wei said the company expects up to 50 tapeouts by the end of the year. TSMC expects 16FF+ to enter commercial production in the second half of the year.
16FF+ is not the only FinFET node coming from TSMC over the next year. The company plans to introduce 16FFC for compact devices sometime in the second half of 2016. In addition, 10nm FinFET is expected to enter risk production by the end of 2015, reports Digitimes.
Can TSMC Beat Samsung?
TSMC has said that it is confident that it can beat Samsung Electronics in ramping up production on its 10nm lines.
Samsung disclosed during a recent technology forum in the US that the company plans to enter mass production of chips using its 10nm FinFET process by the end of 2016,.
But in a statement TSMC claimed it could the outfit said the way things are shaping up it could beat that time table. TSMC continued that in the 10nm FinFET race, Intel will be its major competitor.
We expect to hear a bit more about TSMC’s plans at its Taiwan Technology Symposium 2015 on May 28. At the upcoming event, the foundry is expected to talk about the progress and development of its FinFET manufacturing nodes.
TSMC chairman Morris Chang remarked earlier in 2015 that TSMC expects to gain a majority of market share in the FinFET segment in 2016.
Intel is also expected to release its first chips made using 10nm process technology as early as in the middle of 2016.
MidiaTek Developing Two SoC’s for Tablets
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MediaTek is working on two new tablet SoCs and one of them is rumored to be a $5 design.
The MT8735 looks like a tablet version of Mediatek’s smartphone SoCs based on ARM’s Cortex-A53 core. The chip can also handle LTE (FDD and TDD), along with 3G and dual-band WiFi. This means it should end up in affordable data-enabled tablets. There’s no word on the clocks or GPU.
The MT8163 is supposed to be the company’s entry-level tablet part. Priced at around $5, the chip does not appear to feature a modem – it only has WiFi and Bluetooth on board. GPS is still there, but that’s about it.
Once again, details are sketchy so we don’t know much about performance. However, this is an entry-level part, so we don’t expect miracles. It will have to slug it out with Alwinner’s $5 tablet SoC, which was announced a couple of months ago
According to a slide published by Mobile Dad, the MT8753 will be available later this month, but we have no timeframe for the MT8163.
But there’s nothing to see here as far as Torvalds is concerned. It’s just another day in the office. And all this in “Back To The Future II” year, as well.
Meanwhile under the bonnet, the community are already slaving away on Linux 4.1 which is expected to be a far more extensive release, with 100 code changes already committed within hours of Torvalds announcement of 4.0.
But there is already some discord in the ranks, with concerns that some of the changes to 4.1 will be damaging to the x86 compatibility of the kernel. But let’s let them sort that out amongst themselves.
After all, an anti-troll dispute resolution code was recently added to the Linux kernel in an effort to stop some of the more outspoken trolling that takes place, not least from Torvalds himself, according to some members of the community.
Will Intel Challenge nVidia In The GPU Space?
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Intel has released details of its next -generation Xeon Phi processor and it is starting to look like Intel is gunning for a chunk of Nvidia’s GPU market.
According to a briefing from Avinash Sodani, Knights Landing Chief Architect at Intel, a product update by Hugo Saleh, Marketing Director of Intel’s Technical Computing Group, an interactive technical Q&A and a lab demo of a Knights Landing system running on an Intel reference-design system, Nvidia could be Intel’s target.
Knights Landing and prior Phi products are leagues apart and more flexible for a wider range of uses. Unlike more specialized processors, Intel describes Knights Landing as taking a “holistic approach” to new breakthrough applications.
The current generation Phi design, which operates as a coprocessor, Knights Landing incorporates x86 cores and can directly boot and run standard operating systems and application code without recompilation.
The test system had socketed CPU and memory modules was running a stock Linux distribution. A modified version of the Atom Silvermont x86 cores formed a Knights Landing ’tile’ which was the chip’s basic design unit consisting of dual x86 and vector execution units alongside cache memory and intra-tile mesh communication circuitry.
Each multi-chip package includes a processor with 30 or more tiles and eight high-speed memory chips.
Intel said the on-package memory, totaling 16GB, is made by Micron with custom I/O circuitry and might be a variant of Micron’s announced, but not yet shipping Hybrid Memory Cube.
The high-speed memory is similar to the DDR5 devices used on GPUs like Nvidia’s Tesla.
It looks like Intel saw that Nvidia was making great leaps into the high performance arena with its GPU and thought “I’ll be having some of that.”
The internals of a GPU and Xeon Phi are different, but share common ideas.
Nvidia has a big head start. It has already announced the price and availability of a Titan X development box designed for researchers exploring GPU applications to deep learning. Intel has not done that yet for Knights Landing systems.
But Phi is also a hybrid that includes dozens of full-fledged 64-bit x86 cores. This could make it better at some parallelizable application categories that use vector calculations.
Intel Shows Off The Xeon SoC
Intel has announced details of its first Xeon system on chip (SoC) which will become the new the Xeon D 1500 processor family.
Although it is being touted as a server, storage and compute applications chip at the “network edge”, word on the street is that it could be under the bonnet of robots during the next apocalypse.
The Xeon D SoCs use the more useful bits of the E3 and Atom SoCs along with 14nm Broadwell core architecture. The Xeon D chip is expected to bring 3.4x better performance per watt than previous Xeon chips.
Lisa Spelman, Intel’s general manager for the Data Centre Products Group, lifted the kimono on the eight-core 2GHz Xeon D 1540 and the four-core 2.2GHz Xeon D 1520, both running at 45W. It also features integrated I/O and networking to slot into microservers and appliances for networking and storage, the firm said.
The chips are also being touted for industrial automation and may see life powering robots on factory floors. Since simple robots can run on basic, low-power processors, there’s no reason why faster chips can’t be plugged into advanced robots for more complex tasks, according to Intel.