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Intel, Samsung Behind New Phone OS
October 3, 2011 by admin
Filed under Smartphones
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Two Linux software groups have decided to collaborate, they said on Wednesday, to develop a new operating system for cellphones and other devices in partnerships with Intel and Samsung Electronics.
However, analysts said the new Tizen platform is likely to struggle to attract wider developer and manufacturer support to compete with the dozen or so other mobile operating systems in a market dominated by Apple and Google’s Linux-based Android.
Even industry majors Nokia and Hewlett-Packard have canceled their mobile platforms this year.
“The best hope for them is that big operators get worried by Android’s increasing smartphone dominance and decide to consciously switch their allegiances to rival platforms to restrict Google’s huge influence over the mobile market,” said analyst Neil Mawston from Strategy Analytics.
LiMo Foundation and the Linux Foundation said the new Tizen platform is an open-source, standards-based software platform that supports multiple devices including smartphones, tablets, smart TVs, netbooks and in-vehicle ‘infotainment’ systems.
The initial release is planned for the first quarter of 2012, enabling the first devices using Tizen to come to market in mid-2012, the two groups said.
TSMC May Beat Intel To Market With 3D Chip
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Taiwan Semiconductor Manufacturing Co. is competing with Intel to become the first technology firm to offer three-dimensional chips that boost the density of transistors in a single semiconductor by up to 1000 times.
TSMC, the world’s largest contract chip maker, could make its first 3D chips commercially available before the end of 2011, according to a person close to the situation who wishes to remain anonymous.
The time frame for TSMC matches the end of 2011 schedule that Intel has set for the launch of its 3D Tri-Gate chips, which the company expects to be the world’s first commercial 3D chip and the most significant advance in chip technology since the development of the chip transistor in the 1950s.
With several layers of silicon stacked together, a 3D chip can achieve performance gains of about a third while consuming 50% less power. For this reason, 3D chips are particularly well suited to power new generations of mobile devices such as tablets and mobile phones, businesses where Intel has so far failed to establish a significant presence.
“This is definitely a new business opportunity for TSMC,” said Shang-Yi Chiang, senior vice president for R&D at TSMC, in an interview. “We are building a patent portfolio now.”
3D chips are expected to solve a number of problems for chipmakers who are aiming for performance increases in ever-smaller chips. As transistor density rises, the wires connecting them have become both thinner and closer together, resulting in increased resistance and overheating. These problems cause signal delays, limiting the clock speed of central processing units.
“3D chips look more attractive because of their greater density,” Chiang said. “However, it is more difficult to make them because of the testing issues. If you have five stacked dies and one of the dies is bad, you have to scrap the whole thing.”
DRAM Prices Going Up
iSuppli is reporting that global chip revenue should increase to $325.2 due to supply and demand. Two months ago iSuppli originally forecasted a 5.8 percent increase to $320.1 billion. Apparently, DRAM chips will be impacted the most with a price increase due to supply issues as a result of the recent earthquake in Japan. iSuppli had originally forecasted sales of DRAM chips to shrink by four percent this year instead of seeing a drop of 10.6 percent.
Samsung Gains On Intel
Globally semiconductor revenue is expected to increase this year, with Samsung gaining noticeable ground on top semiconductor company Intel in market share, Gartner said in a study released Wednesday.
Revenue is expected to reach a “landmark” US$300.3 billion in 2010, up 31.5% from 2009, according to preliminary results released by Gartner. The semiconductor market has been rebounding after the worldwide recession curtailed chip revenue in 2009, when year-over-year revenue declined by 10%.
As the economy stabilized this year, semiconductors manufacturers quickly added capacity to meet the growing demand of parts from system makers. But semiconductor demand started weakening again starting in the third quarter this year, Gartner said. Read More……