Sign up for our Technology Newsletter 
Memory Chips Appear To Be Dropping
The production value of memory chips in Korea fell by a percent on the previous quarter, affected mainly by a low bit growth of DRAM and NAND flash chips from SK Hynix.
Beancounters at Digitimes Research said that sales totaled US$12 billion in the second quarter of 2015, increasing 1 per cent from the previous quarter,
Server-use DRAM products became the primary product line for SK Hynix for the first time in the second quarter as sales of its PC-use DRAM chips suffered a significant decline compared to a quarter earlier.
Price reductions of PC DRAM chips were greater than market expectations in the second quarter due to an oversupply in the market, affecting sales performance of SK Hynix.
Samsung was less affected by declining PC DRAM prices because mobile DRAM products accounted for 35 per cent of its total DRAM income.
Samsung memory and semiconductor revenues hit a record high in the second quarter.
For the third quarter, the bit growth rates of NAND flash shipments at Samsung will rise 10 per cent and SK Hynix will increase 13 per cent on quarter.
SK Hynix will manage a five to eight per cent growth while Samsung is expected to see shipments of its DRAM chips grow 12-14 per cent.
Digitimes Researcher flipped their iChing coins and came to the conclusion that Korea’s memory products are expected to increase 3 per cent on quarter and 12 per cent on year in the third quarter of 2015.
Source
New USB Chip Developed
October 18, 2013 by admin
Filed under Uncategorized
Comments Off on New USB Chip Developed
Silicon Motion says it has begun shipping samples of a new USB 3.0 controller chip for flash drives that could boost performance by up to 50%.
The company said the new SM3267 integrated controller is expected to deliver up to 160MB/s read, and 60MB/s write speeds through a single channel; that would be a 30% to 50% performance improvement over today’s USB 3.0 flash drive technology.
Even though the USB 3.0 specification has the capability to support 4.8Gbps throughput speeds, the speed of a USB 3.0-enabled flash drive is dictated by the speed of the accessing flash devices in the drive. Today, most consumer-USB 3.0 flash drives support about 100MB/s read speeds.
We are pleased to announce that SM3267 has received design-ins from most of our current USB controller customers, including many top-tier OEMs, and we expect SM3267-based USB 3.0 flash drives will be commercially available starting in the fourth quarter of 2013,” Wallace Kou, CEO of Silicon Motion, said in a statement.
The new integrated chip will also be able to run at lower voltages, from 5 volts to 1.2 volts, enabling a 25% to 30% lower USB flash drive device temperature compared with other USB 3.0 flash controller products in the market, Silicon Motion said.
The new IC will support the vast majority of NAND flash technology, including new triple-level cell (TLC), multi-level cell (MLC), high speed Toggle, and ONFI DDR NAND manufactured by Samsung, Toshiba, SanDisk, SK Hynix, Micron and Intel.
The new chip has already passed both USB-IF compliance testing and WHCK (Windows Hardware Certification Kit) tests for Windows 7 and Windows 8.
The new IC is available in a Chip-on-Board (COB) and in a 48-pin QFN green package.