Sign up for our Technology Newsletter 
Marvell’s Future Brightens
Marvell reported a more-than-expected 112 percent rise in profit, helped by strong demand from storage and networking companies, and said it expected its mobile business to pick up in the current quarter.
Marvell forecast first-quarter revenue between $870 and $910 million, which is above what the cocaine nose jobs of Wall Street predicted. Chief Executive Sehat Sutardja said that in his company’s first quarter, he was expecting some revenue and unit growth for our 4G LTE mobile platform from multiple customers. Marvell said results were not so hot in the mobile business in the fourth quarter as some customers delayed product launches.
The company, which also makes communications and processor products used in mobile phones, said net income doubled to $106.6 million, or 21 cents per share, in the quarter ended February 1 from $50.2 million, or 9 cents per share, a year earlier.
Revenue rose to $931.7 million, beating analysts’ estimate of $901.1 million.
Marvell’s biggest customer is Western Digital which reported better-than-expected quarterly results in January, citing strength in its gaming and notebook business.
Is Intel Expanding?
Even if it means that it will be the first to make ARM’s 64-bit chips, Intel said that it wants to expand its contract foundry work. Intel CEO Brian Krzanich said he would expand his company’s small contract manufacturing business, paving the way for more chipmakers to tap into the world’s most advanced process technology.
Krzanich told analysts that he planned to step up the company’s foundry work, effectively giving Intel’s process technology to its rivals. He said that company’s who can use Intel’s leading edge and build computing capabilities that are better than anyone else’s, are good candidates for foundry service. Krzanich added that the slumping personal computer industry, Intel’s core market, was showing signs of bottoming out.
Intel also unveiled two upcoming mobile chips from its Atom line designed interchange features to create different versions of the component. A high-end version of the new chip, code named Broxton, and is due out in mid-2015. SoFIA, a low-end chip was shown as an example of Intel’s pragmatism and willingness to change how it does business. Krzanich said that in the interest of speed, SoFIA would be manufactured outside of Intel, with the goal of bringing it to market next year.
Intel will move production of SoFIA chips to its own 14 nanometer manufacturing lines, Krzanich added.
Chip Makers Going After Cars
October 14, 2013 by admin
Filed under Around The Net
Comments Off on Chip Makers Going After Cars
Chip makers including Broadcom and Renesas Electronics are putting more focus on in-car entertainment with faster processors and networks for wireless HD movies and navigation, aiming to keep drivers informed and passengers entertained.
With PC sales slipping and the mobile device market proving highly competitive, chip makers are looking for greener pastures in other sectors like in-car entertainment and information.
From Renesas comes the R-Car M2 automotive SoC (System-on-a-Chip), which has enough power to handle simultaneous high-definition navigation, video and voice-controlled browsing.
The SoC is meant for use in mid-range systems. It features two ARM Cortex A-15 cores running at up to 1.5GHz and Renesas’ own SH-4A processor plus the PowerVR SGX544MP2 from Imagination Technologies for 3D graphics. This combination helps the M2 exceed the previous R-Car H1 with more than three times the CPU capacity and approximately six times better graphics performance.
Car makers that want to put a more advanced entertainment system in their upcoming models should go for the eight core R-Car H2 SoC, which was announced earlier this year. It is based on ARM’s big.LITTLE architecture, and uses four Cortex-A15 cores and another four Cortex-A7 cores.
The H2 will be able to handle four streams of 1080p video, including Blu-Ray at 60 frames per second, according to Renesas. Mass production is scheduled for the middle of next year, while the M2 won’t arrive in larger volumes until June 2015.
Broadcom on the other hand is seeking to drive better networking on the road. The company’s latest line of wireless chipsets for in-car connectivity uses the fast 802.11ac Wi-Fi wireless standard, which offers enough bandwidth for multiple displays and screen resolution of up to 1080p. Use of the 5GHz band for video allows it to coexist with Bluetooth hands-free calls on 2.4GHz, according Broadcom.
Broadcom has also implemented Wi-Fi Direct and Miracast. Wi-Fi Direct lets products such as smartphones, cameras and in this case in-car computers connect to one another without joining a traditional hotspot network, while Miracast lets users stream videos and share photos between smartphones, tablets and displays.
The BCM89335 Wi-Fi and Bluetooth Smart Ready combo chip and the BCM89071 Bluetooth and Bluetooth Smart Ready chip are now shipping in small volumes.
AMD’s Richland Shows Up
Kaveri is coming in a few months, but before it ships AMD will apparently spice up the Richland line-up with a few low-power parts.
CPU World has come across an interesting listing, which points to two new 45W chips, the A8-6500T and the A10-6700T. Both are quads with 4MB of cache. The A8-6500T is clocked at 2.1GHz and can hit 3.1GHz on Turbo, while the A10-6700T’s base clock is 2.5GHz and it maxes out at 3500MHz.
The prices are $108 and $155 for the A8 and A10 respectively, which doesn’t sound too bad although they are still significantly pricier than regular FM2 parts.
AMD’s Kaveri Coming In Q4
AMD really needs to make up its mind and figure out how it interprets its own roadmaps. A few weeks ago the company said desktop Kaveri parts should hit the channel in mid-February 2014. The original plan called for a launch in late 2013, but AMD insists the chip was not delayed.
Now though, it told Computerbase.de that the first desktop chips will indeed appear in late 2013 rather than 2014, while mobile chips will be showcased at CES 2014 and they will launch in late Q1 or early Q2 2014.
As we reported earlier, the first FM2+ boards are already showing up on the market, but at this point it’s hard to say when Kaveri desktop APUs will actually be available. The most logical explanation is that they will be announced sometime in Q4, with retail availability coming some two months later.
Kaveri is a much bigger deal than Richland, which was basically Trinity done right. Kaveri is based on new Steamroller cores, it packs GCN graphics and it’s a 28nm part. It is expected to deliver a significant IPC boost over Piledriver-based chips, but we don’t have any exact numbers to report.
Marvell Loses In Court
A federal judge denied Marvell’s request to declare a mistrial in a patent infringement case in which a jury awarded $1.17 billion in damages to Carnegie Mellon University.
Carnegie Mellon sued Marvell in March 2009 over patents issued in 2001 and 2002 related to how accurately hard disk-drive circuits read data from high-speed magnetic disks. The suit involved nine Marvell circuits which incorporated the patents, and that the infringement let the Bermuda outfit blog billions of chips with its tech on board.
The damages award in December 2012 was one of the largest by a US jury in a patent infringement case. Marvell asked the judge to declare a mistrial and it claimed that Carnegie Mellon’s lawyer made improper, misleading and prejudicial comments during closing arguments that “inflamed” the jury.
US District Judge Nora Barry Fischer in Pittsburgh federal court disagreed and said that Marvell was trying to do what it could not do at trial convince the court to throw out this case and have another crack at it. Marvel has said that it will appeal so this case will run and run.
Will Qualcomm Be First?
We could not get the right timeframe for the launch of Qualcomm’s successor to the high-end Snapdragon 800, but there is no doubt that Qualcomm, Samsung, Nvidia and other ARM supporters are thinking about 20nm products where some of them will be based on Cortex A57.
Qualcomm has its own Krait core that can be adapted to 20nm and follow up the success of Snapdragon 600 and the soon to come Snapdragon 800. It turns out that it traditionally takes 18 to 24 months for the mobile industry to shift from one process to another and Qualcomm had its first 28nm part in April 2012, with the Snapdragon S4, used in the HTC One S. The first ever 28nm part from Qualcomm was the Snapdragon S4 MSM8260A that is now more than a year old and a relatively obsolete product.
Less than a year after the first 28nm product Qualcomm followed up with the Snapdragon 600 that is shipping in millions of high end devices right now. In a month or two it plans to release Snapdragon 800 based on new Krait 400 core and add a new core and get even better performance.
The next step is the 20nm core that should start shipping before the end of 1H 2014. We would not be surprised to see 20nm Krait demoed at CES 2014 already in January, see more of it at the Mobile World Congress in February and the volume shipment to follow in early Q2 2014. This is the expected schedule and not something we got from Qualcomm.
The only official world we got is that the new generation traditionally comes 18 to 24 months after the first iteration of a current one. This can give you an idea that Tegra 5, codenamed Logan, should show up at a similar time, along with Samsung’s 20nm Exynos.
Qualcomm surpasses AMD
May 30, 2013 by admin
Filed under Uncategorized
Comments Off on Qualcomm surpasses AMD
It’s no secret that the mobile boom is taking a toll on makers of PC components and AMD is one of them. According to data from IC Insights, Qualcomm and Samsung have managed to pass AMD in microprocessor sales last year.
Intel still dominates the market, with $36.9 billion sales and a 65.3 percent market share. However, Qualcomm has managed to squeeze into second spot, with $5.3 billion in sales and a 9.4 percent share. Samsung ranked third, with $4.66 in sales and an 8.2 percent market share. Qualcomm and Samsung also recorded plenty of growth, 28 and 78 percent respectively.
However, AMD slumped 21 percent to take 6.4 percent of the market, with $3.6 billion in sales. It was still ahead of Freescale and Nvidia, as well as Texas Instruments and ST Ericsson.
It should be noted that about 83 percent of Samsung’s revenue came from chips churned out for Apple. In other words, had Apple built the chips on its own, it would have tied with AMD for the third spot.
TSMC Testing ARM’s Cortex A57
ARM and TSMC have manufactured the first Cortex A57 processor based on ARM’s next-gen 64-bit ARMv8 architecture.
The all new chip was fabricated on TSMC’s equally new FinFET 16nm process. The 57 is ARM’s fastest chip to date and it will go after high end tablets, and eventually it will find its place in some PCs and servers as well.
Furthermore the A57 can be coupled with frugal Cortex A53 cores in a big.LITTLE configuration. This should allow it to deliver relatively low power consumption, which is a must for tablets and smartphones. However, bear in mind that A15 cores are only now showing up in consumer products, so it might be a while before we see any devices based on the A57.
In terms of performance, ARM claims the A57 can deliver a “full laptop experience,” even when used in a smartphone connected to a screen, keyboard and mouse wirelessly. It is said to be more power efficient than the A15 and browser performance should be doubled on the A57.
It is still unclear when we’ll get to see the first A57 devices, but it seems highly unlikely that any of them will show up this year. Our best bet is mid-2014, and we are incorrigible optimists. The next big step in ARM evolution will be 20nm A15 cores with next-generation graphics, and they sound pretty exciting as well.
TSMC And Imagination Team Up
TSMC and Imagination Technologies announced the next step in their tech collaboration in an effort to develop Imagination’s next generation PowerVR 6-series GPUs.
The new GPUs are still not ready for prime time, but they should be used in future SoC designs, including those stamped out using TSMC’s 16nm FinFET process. The two companies will work to create new reference system designs, utilizing high bandwidth memory standards and TSMC’s 3D IC technology.
As GPU muscle becomes more important for next generation SoCs, designers need more advanced and more complex processes, such as TSMC’s 16FinFET.
“Through advanced projects initiated under this partnership, Imagination and TSMC are working together to showcase how SoCs will transform the future of mobile and embedded products,” said Hossein Yassaie, CEO of Imagination.
TSMC VP Cliff Hou argued that the need for high performance mobile GPUs will drive silicon processes in the future, much in the same way CPU development pushed new processes in the nineties.