Intel Rewards RealSense Developers

Intel has awarded  $1m to a number of developers as part of its RealSense 3D App Challenge, which was launched last year.

Announced by Intel president Renee James at Computex 2014, the RealSense App Challenge was part of Intel’s efforts to boost RealSense globally and generate software innovation around the ecosystem.

More than 7,000 software creators in 37 countries applied to compete, and 400 were selected to develop new applications for entertainment, learning and collaboration.

Several hundred developers of creative app ideas in these categories received the latest edition of the RealSense 3D Camera and RealSense software development kit, which included free tools, examples and application programing interfaces with which to develop their ideas.

Intel announced on Thursday that the grand prize winner, who picks up $100,000, is Brazilian developer Alexandre Ribeiro da Silva of Anima Games.

His Seed app requires gamers to use reflexes and rational thinking to solve puzzles. The goal of the game is to guide a little floating seed through its journey to reforest a devastated land.

The second prize of $50,000 was awarded to Canadian developer David Schnare of Kinetisense. His OrthoSense app uses RealSense to help medical professionals remotely rehabilitate a patient who has suffered a hand injury by tracking their range of movement over time.

“This practical application of human-computer interaction is an impressive example of how technology can make our lives better,” Intel said.

Another notable winner was Lee Bamber from the UK, who received recognition for his virtual 3D video maker. The app allows a user to record themselves as a 3D hologram and then transport to a variety of scenes.

Once recorded, they can then change the camera position over the course of the playback to add an extra dimension to a video blogs, storybook or v-mails, for instance.

“The idea of the app is that you can choose the backdrop then set the lighting as you would in a studio then do the acting,” Bamber explained in his video.

Doug Fisher, SVP and general manager of Intel’s Software and Services Group, said in a blog post that now the app challenge is complete “the real work begins”, as Intel Software will continue to encourage all finalists to bring products to market.

“We also will continue mobilising our resources to inspire, educate and advance innovation through programmes such as the Intel Developer Zone, where developers can engage to find new software tools and build industry relationships,” he said.

“Human-computer interactions will no longer be defined by mice, keyboards and 2D displays. Our physical and digital worlds are coming together. When they do, the opportunities for us as consumers and businesses will explode.”

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Qualcomm Gives Snapdragon More Umph

Qualcomm has released a new Trepn Profiler app for Android which will profile Snapdragon processors and tinker with them.

The Trepn Profiler app identifies apps that overwork the CPU or are eating too much data. The app will pinpoint which of the apps drain the battery faster.

All data that will be obtained by this app can provide information you need to know which program is slowing down your phone.

Most Android phone users will not give a damn, but developers will find it useful. Those who are interested in testing roms, custom kernels, and their own apps can use the data gathered by the Trepn Profiler.

Developers can measure optimisation and performance on Snapdragon-powered mobile devices. Data are real-time include network usage, battery power, GPU frequency load, and CPU cores’ load. Key features also include six fast-loading profiling presets, and an advanced mode to manually select data points and save for analysis.

The Advanced Mode allows profiling a single app or device, offline data analysis, and increasing of data collection interval. This special mode also allows longer profiling sessions, displaying two data point in one overlay, and viewing of profile data.

All up this should enable developers to come up with more Snapdragon friendly apps.

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AMD To Power Samsung’s Digital Media

AMD’s Embedded R-Series accelerated processing unit, previously codenamed “Bald Eagle,” is powering Samsung’s latest set-back-box digital media players.

Bald Eagle was designed for high performance at low power with broad connectivity but mostly for digital signage.

It seems that new Samsung SBB-B64DV4 is intended for demanding signage applications that transform Samsung SMART Signage Displays into digital tools for a wide range of business needs.

The chipmaker claimed that by using its Embedded R-Series APUs, Samsung SBB media players for digital signage can manage HD graphics performance and support multivideo stream capabilities up to two displays, in a power efficient and ultra-compact form factor.

Scott Aylor, corporate vice president and general manager, AMD Embedded Solutions said that digital signage is a key vertical for the AMD Embedded business.

“The AMD Embedded R-Series APU enables leading digital signage providers to harness high levels of compute and graphics performance within a low-power design envelope. AMD Embedded Solutions help designers at Samsung achieve aggressive form factor goals and drive down system costs while providing the rich multimedia their digital signage customers’ demand,” he said.

The AMD Embedded RX-425BB APU combines an x86 CPU with an integrated, discrete-class AMD Radeon R6 graphics processing unit in a low-power configuration to minimize heat dissipation constraints and meet energy efficiency requirements.

The processor uses AMD’s latest Graphics Core Next architecture, created for advanced graphics applications and parallel processing capabilities.

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Is EA Shuttering It’s Free To Play Model?

EA is shuttering four high-profile free-to-play games, all of them allied to popular IP like Battlefield and FIFA.

Battlefield Heroes, Battlefield Play4Free, Need for Speed World and FIFA World will all continue for another 90 days, at which point they will be taken offline for good. Further development on the games has stopped already.

“In more than five years since most of these titles launched, how we play games has changed dramatically,” said Patrick Soderlund, EVP of EA Games, in a statement. “These were pioneering experiences, and we’re humbled that, over the years, so many of you joined us to enjoy the games and the community.”

In terms of EA’s growing interest in free-to-play models, the real pioneer among that group is Battlefield Heroes, which was pitched at “frustrated, restricted” gamers back in 2008. Need for Speed World and Battlefield Play4Free followed, launching over the second half of 2010.

By the start of 2012, EA was reporting a combined total of 25 million players across the six games in its “Play4Free” initiative, with Battlefield Heroes and Need for Speed World contributing 10 million players each.

However, FIFA World is by no means a forerunner. It only reaching open beta late in 2013, and so it is being shuttered after substantially less than two years of public availability. This wouldn’t imply a slow decline in interest, but a lack of interest in the first place.

That’s in stark contrast to FIFA Online, the free-to-play version of the game made specifically for markets in Asia. In 2012, EA’s Andrew Wilson claimed that FIFA Online was making $100 million a year in revenue. A year later, FIFA Online 3, the most recent iteration, was the leading online sports game in both traffic and revenue in Korea.

One thing is certain, take these four titles away from EA’s free-to-play games on Origin, and you’re left with only Command & Conquer: Tiberium Alliances and Star Wars: The Old Republic – in his statement, Soderlund stressed the latter’s “enthusiastic and growing” community, and reiterated EA’s commitment to providing new content.

The remainder of the company’s free-to-play catalog is composed of games like Outernauts, The Simpsons: Tapped Out and Bejeweled Blitz. Casual, social, call them what you will, but they are intended for a very different audience to Need for Speed World and Battlefield Play4Free, and that audience has just lost two-thirds of the games EA had made to satisfy its needs.

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MidiaTek Developing Two SoC’s for Tablets

MediaTek is working on two new tablet SoCs and one of them is rumored to be a $5 design.

The MT8735 looks like a tablet version of Mediatek’s smartphone SoCs based on ARM’s Cortex-A53 core. The chip can also handle LTE (FDD and TDD), along with 3G and dual-band WiFi. This means it should end up in affordable data-enabled tablets. There’s no word on the clocks or GPU.

The MT8163 is supposed to be the company’s entry-level tablet part. Priced at around $5, the chip does not appear to feature a modem – it only has WiFi and Bluetooth on board. GPS is still there, but that’s about it.

Once again, details are sketchy so we don’t know much about performance. However, this is an entry-level part, so we don’t expect miracles. It will have to slug it out with Alwinner’s $5 tablet SoC, which was announced a couple of months ago

According to a slide published by Mobile Dad, the MT8753 will be available later this month, but we have no timeframe for the MT8163.

But there’s nothing to see here as far as Torvalds is concerned. It’s just another day in the office. And all this in “Back To The Future II” year, as well.

Meanwhile under the bonnet, the community are already slaving away on Linux 4.1 which is expected to be a far more extensive release, with 100 code changes already committed within hours of Torvalds announcement of 4.0.

But there is already some discord in the ranks, with concerns that some of the changes to 4.1 will be damaging to the x86 compatibility of the kernel. But let’s let them sort that out amongst themselves.

After all, an anti-troll dispute resolution code was recently added to the Linux kernel in an effort to stop some of the more outspoken trolling that takes place, not least from Torvalds himself, according to some members of the community.

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RadioShack Plans To Sell Customer Data

RadioShack plans to keep moving forward with its plan to sell its customer data, despite opposition from a number of states.

The company has asked a bankruptcy court for approval for a second auction of its assets, which includes the consumer data.

The state of Texas, which is leading the action by the states, opposed the sale of personally identifiable information (PII), citing the online and in-store privacy policies of the bankrupt consumer electronics retailer.

The state claimed that it found from a RadioShack deposition that the personal information of 117 million customers could be involved. But it learned later from testimony in court that the number of customer files offered for sale might be reduced to around 67 million.

In the first round of the sale, RadioShack sold about 1,700 stores to hedge fund Standard General, which entered into an agreement to set up 1,435 of these as co-branded stores with wireless operator Sprint. Some other assets were also sold in the auction.

The sale of customer data, including PII, was withdrawn from the previous auction, though RadioShack did not rule out that it could be put up for sale at a later date.

The case could have privacy implications for the tech industry as it could set a precedent, for example, for large Internet companies holding consumer data, if they happen to go bankrupt.

Texas has asked the U.S. Bankruptcy Court for the District of Delaware for a case management order to ensure that in any motion for sale of the PII, RadioShack should be required to provide information on the kind of personal data that is up for sale and the number of customers that will be affected.

On Monday, Texas asked the court that its motion be heard ahead of RadioShack’s motion for approval to auction more assets.

The court had ordered in March the appointment of a consumer privacy ombudsman in connection with the potential sale of the consumer data including PII. RadioShack said in a filing Friday that it intends to continue working with the ombudsman and the states with regard to any potential sale of PII, but did not provide details.

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RedHat And Canonical Discuss Linux 4.0

Red Hat has been telling everyone  its plans to integrate the latest Linux 4.0 kernel into its products.

In a statement, a spokesman told us, “Red Hat’s upstream community projects will begin working with 4.0 almost immediately; in fact, Fedora 22 Alpha was based on the RC1 version of the 4.0 kernel.

“From a productization perspective, we will keep an eye on these integration efforts for possible inclusion into Red Hat’s enterprise portfolio.

“As with all of our enterprise-grade solutions, we provide stable, secure and hardened features, including the Linux kernel, to our customers – once we are certain that the next iterations of the Linux kernel, be it 4.0 or later, has the features and maturity that our customer base requires, we will begin packaging it into our enterprise portfolio with the intention of supporting it for 10 years, as we do with all of our products.”

Meanwhile, Canonical Head Honcho Mark Shuttleworth has confirmed that Linux Kernel 4.0 should be making its debut in Ubuntu products before the end of the year.

In an earlier note to The INQUIRER, Shuttleworth confirmed that the newly released kernel’s integration was “likely to be in this October release.”

The news follows the release of version 4.0 of the Linux kernel in a flurry of what T S Eliot would describe as “not with a bang but a whimper”.

Writing on the Linux Kernel Mailing List on Sunday afternoon, Linux overlord Linus Torvalds explained that the new version was being released according to schedule, rather than because of any dramatic improvements, and because of a lack of any specific reason not to.

“Linux 4.0 was a pretty small release in linux-next and in final size, although obviously ‘small’ is relative. It’s still over 10,000 non-merge commits. But we’ve definitely had bigger releases (and judging by linux-next v4.1 is going to be one of the bigger ones),” he said.

“Feature-wise, 4.0 doesn’t have all that much special. Much has been made of the new kernel patching infrastructure, but realistically that wasn’t the only reason for the version number change. We’ve had much bigger changes in other versions. So this is very much a ‘solid code progress’ release.”

Come to think of it, it is very unlikely that T S Eliot would ever have written about Linux kernels, but that’s not the point.

Torvalds, meanwhile, explained that he is happier with releasing to a schedule rather than because of any specific feature-related reason, although he does note that there have been four billion code commits, and Linux 3.0 was released after the two billion mark, so there’s a nice symmetry there.

In fact, back in 2011 the version numbering of the Linux kernel was a matter of some debate, and Torvalds’ lacklustre announcement seems to be pre-empting more of the same.

In a subsequent post Torvalds jokes, “the strongest argument for some people advocating 4.0 seems to have been a wish to see 4.1.15 – because ‘that was the version of Linux Skynet used for the T-800 Terminator.’”

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Did AMD Commit Fraud?

AMD must face claims that it committed securities fraud by hiding problems with the bungled 2011 launch of Llano that eventually led to a $100 million write-down, a US court has decided.

According to Techeye US District Judge Yvonne Gonzales Rogers said plaintiffs had a case that AMD officials misled them by stating in the spring of 2011 and will have to face a full trial.

The lawsuit was over the Llano chip, which AMD had claimed was “the most impressive processor in history.”

AMD originally said that the product launch would happen in the fourth quarter of 2010, sales of the Llano were delayed because of problems at the company’s chip manufacturing plant.

The then Chief Financial Officer Thomas Seifert told analysts on an April 2011 conference call that problems with chip production for the Llano were in the past, and that the company would have ample product for a launch in the second quarter.

Press officers for AMD continued to insist that there were no problems with supply, concealing the fact that it was only shipping Llanos to top-tier computer manufacturers because it did not have enough chips.

By the time AMD ramped up Llano shipments in late 2011, no one wanted them any more, leading to an inventory glut.
AMD disclosed in October 2012 that it was writing down $100 million of Llano inventory as not shiftable.

Shares fell nearly 74 percent from a peak of $8.35 in March 2012 to a low of $2.18 in October 2012 when the market learned the extent of the problems with the Llano launch.

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Toshiba And SanDisk Launch 3D Flash Chip

Toshiba has announced the world’s first 48-layer Bit Cost Scalable (BiCS) flash memory chip.

The BiCS is a two-bit-per-cell, 128Gb (16GB) device with a 3D-stacked cell structure flash that improves density and significantly reduces the overall size of the chip.

Toshiba is already using 15nm dies so, despite the layering, the finished product will be competitively thin.

24 hours after the first announcement, SanDisk made one of its own regarding the announcement. The two companies share a fabrication plant and usually make such announcements in close succession.

“We are very pleased to announce our second-generation 3D NAND, which is a 48-layer architecture developed with our partner Toshiba,” said Dr Siva Sivaram, executive vice president of memory technology at SanDisk.

“We used our first generation 3D NAND technology as a learning vehicle, enabling us to develop our commercial second-generation 3D NAND, which we believe will deliver compelling storage solutions for our customers.”

Samsung has been working on its own 3D stacked memory for some time and has released a number of iterations. Production began last May, following a 10-year research cycle.

Moving away from the more traditional design process, the BiCS uses a ‘charge trap’ which stops electrons leaking between layers, improving the reliability of the product.

The chips are aimed primarily at the solid state drive market, as the 48-layer stacking process is said to enhance reliability, write speed and read/write endurance. However, the BiCS is said to be adaptable to a number of other uses.

All storage manufacturers are facing a move to 3D because, unless you want your flash drives very long and flat, real estate on chips is getting more expensive per square inch than a bedsit in Soho.

Micron has been talking in terms of 3D NAND since an interview with The INQUIRER in 2013 and, after signing a deal with Intel, has predicted 10TB in a 2mm chip by the end of this year.

Production of the chips will roll out initially from Fab 5 before moving in early 2016 to Fab 2 at the firm’s Yokkaichi Operations plant.

This is in stark contrast to Intel, which mothballed its Fab 42 chip fabrication plant in Chandler, Arizona before it even opened, as the semiconductors for computers it was due to produce have fallen in demand by such a degree.

The Toshiba and Sandisk BiCS chips are available for sampling from today.

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Will Intel Challenge nVidia In The GPU Space?

Intel has released details of its next -generation Xeon Phi processor and it is starting to look like Intel is gunning for a chunk of Nvidia’s GPU market.

According to a briefing from Avinash Sodani, Knights Landing Chief Architect at Intel, a product update by Hugo Saleh, Marketing Director of Intel’s Technical Computing Group, an interactive technical Q&A and a lab demo of a Knights Landing system running on an Intel reference-design system, Nvidia could be Intel’s target.

Knights Landing and prior Phi products are leagues apart and more flexible for a wider range of uses. Unlike more specialized processors, Intel describes Knights Landing as taking a “holistic approach” to new breakthrough applications.

The current generation Phi design, which operates as a coprocessor, Knights Landing incorporates x86 cores and can directly boot and run standard operating systems and application code without recompilation.

The test system had socketed CPU and memory modules was running a stock Linux distribution. A modified version of the Atom Silvermont x86 cores formed a Knights Landing ’tile’ which was the chip’s basic design unit consisting of dual x86 and vector execution units alongside cache memory and intra-tile mesh communication circuitry.

Each multi-chip package includes a processor with 30 or more tiles and eight high-speed memory chips.

Intel said the on-package memory, totaling 16GB, is made by Micron with custom I/O circuitry and might be a variant of Micron’s announced, but not yet shipping Hybrid Memory Cube.

The high-speed memory is similar to the DDR5 devices used on GPUs like Nvidia’s Tesla.

It looks like Intel saw that Nvidia was making great leaps into the high performance arena with its GPU and thought “I’ll be having some of that.”

The internals of a GPU and Xeon Phi are different, but share common ideas.

Nvidia has a big head start. It has already announced the price and availability of a Titan X development box designed for researchers exploring GPU applications to deep learning. Intel has not done that yet for Knights Landing systems.

But Phi is also a hybrid that includes dozens of full-fledged 64-bit x86 cores. This could make it better at some parallelizable application categories that use vector calculations.

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