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AMD’s Carrizo Coming In The Second Quarter
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AMD released its earnings today and one cool question came up about the upcoming Carrizo mobile APU.
Lisa SU, the new AMD President and CEO, told MKM Partners analyst Ian Ing that Carrizo is coming in Q2 2015.
This is a great news and AMD’s Senior VP and outgoing general manager of computing and graphics group John Byrne already shared a few details about his excitement about Carrizo.
There are two Carrizo parts, one for big notebooks and All in Ones called Carrizo and a scaled down version called Carrizo L. We expect that the slower Carrizo-L is first to come but, Lisa was not specific. Carrizo-L is based on Puma+ CPU cores with AMD Radeon R-Series GCN graphics is intended for mainstream configurations with Carrizo targeting the higher performance notebooks.
Usually when a company says that something is coming in Q2 2015 that points to a Computex launch and this Taipei based tradeshow starts on June 2 2015. We strongly believe that the first Carrizo products will showcased at or around this date.
Lisa also pointed out that AMD has “significantly improved performance in battery life in Carrizo.” This is definitely good news, as this was one of the main issues with AMD APUs in the notebook space.
Lisa also said that AMD expects Carrizo to be beneficial for embedded and other businesses as well. If only it could have come a bit earlier, so let’s hope AMD can get enough significant design wins with Carrizo. AMD has a lot of work to do in order to get its products faster to market, to catch up with Intel on power and performance or simply to come up with innovative devices that will define its future. This is what we think Lisa is there for but in chip design, it simply takes time.
AMD Headed To The Facial Recognition Space
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AMD has developed facial recognition technology to enable users to organize and search video clips based on the people featured in them.
AMD executive Richard Gayle demonstrated to Tom’s Guide how AMD Content Manager, uses facial recognition to browse through a group of local videos to find specific faces.
There is an index that displays the people’s faces that have been detected throughout the video clips.
The user can edit the names of the people as well as add keyword tags to help improve future searches for specific people.
For instance, if you are searching for videos that feature one person, you can click on his or her respective face to pull up the corresponding videos.
Additionally, if you want to narrow a search to a specific person combined with a keyword tag, you can drag the face icon and click on the desired keyword.
Once you click on the video you wish to view, a player appears in the right windowpane, along with a timeline displayed at the bottom with a list of all the people who appear in the video.
The timeline is separated into various coloured boxes to mark the exact moment in the video when each person first appears on screen, so you do not have to watch the entire video to see the bit you want.
The application also has facial recognition capabilities that allow users to do some basic editing, such as compiling a single montage video of any individual or individuals.
While this is pretty good technology, it probably does not have any major use yet on its own.
Gayle said it is unlikely that AMD will release Content Manager in its current form but will license it to OEMs that are able to rebrand the application before offering it on their respective systems.
He claimed that only AMD processors have sufficient power to operate the application, because of the processor’s ability to have the CPU, GPU and memory controller work closely together.
AMD’s Fiji GPU Goes High Bandwidth
New evidence coming from two LinkedIn profiles of AMD employees suggest that AMD’s upcoming Radeon R9 380X graphics card which is expected to be based on the Fiji GPU will actually use High-Bandwidth Memory.
Spotted by a member of 3D Center forums, the two LinkedIn profiles mention both the R9 380X by name as well as describe it as the world’s firts 300W 2.5D discrete GPU SoC using stacked die High-Bandwidth Memory and silicon interposer. While the source of the leak is quite strange, these are more reliable than just rumors.
The first in line is the profile of Ilana Shternshain, an ASIC Physical Design Engineer, which has been behind the Playstation 4 SoC, Radeon R9 290X and R9 380X, which is described as the “largest in ‘King of the hill’ line of products.”
The second LinkedIn profile is the one from AMD’s System Architect Manager, Linglan Zhang, which was involved in developing “the world’s first 300W 2.5D discrete GPU SOC using stacked die High Bandwidth Memory and silicon interposer.”
Earlier rumors suggest that AMD might launch the new graphics cards early this year as the company is under heavy pressure from Nvidia’s recently released, as well as the upcoming, Maxwell-based graphics cards.
Will Intel Assist Apple?
Apple is apparently having problems getting its partners to make 3-D transistors that go.
Drexel Hamilton’s chip analyst Rick Whittington [no really] made a comment that Intel might be getting ready to bail Apple out while he was having a chat about Micron. In passing, Whittington noted problems had by Taiwan Semiconductor and Samsung Electronics trying to produce 3-D transistors in any useful yield.
He noted that Intel has mastered 3-D transistors, and said that it would be very good for Intel if neither Samsung or TSM can do FinFET this next year; puts them in line to supply Apple’s internal foundry needs.
However he admitted that it was more that TSM/Samsung would operate FinFET under very low yield output and keep capacity tight.
Of course if Jobs’ Mob don’t want that they can always rush into the loving arms of Chipzilla – again. As happened with Saphire glass Apple has shown that it can dump a partner quickly if it does not move fast enough.
Samsung Finally Starts 14nm FinFET
A company insider has spilled the beans in Korea, claiming that Samsung has started Apple A9 production in 14nm FinFET.
The A9 is the next generation SoC for Apple iPhone and iPad products and it is manufactured on the Samsung – GlobalFoundries 14nm FinFET manufacturing process. In the other news, Samsung’s Ki-nam, president of the company’s semiconductor business and head of System LSI business has confirmed that the company started production of 14-nanometre FinFET chips.
The report mentions Austin as a possible site for Apple products but we wonder if the GlobalFoundries Fab 8 in New York State could become one of the partners for the 14nm FinFET manufacturing. Samsung didn’t officially reveal the client for the 14nm FinFET, but Apple is the most obvious candidate, while we expect to see 14 / 16nm FinFET graphics chips from AMD and Nvidia but most likely in the latter half of 2015 at best.
Qualcomm is likely to announce new LTE modem based on 14nm FinFET and the flagship SoC Snapdragon 810 is a 20nm chip. Qualcomm is manufacturing its 810 chips as we speak to meet demand for flagship Android phones coming in Q1 2015. Flagship Samsung, HTC and LG phones among others are likely to use Snapdragon 810 as a replacement for this year’s Snapdragon 801, a high end chip that ended up in millions of high-end phones.
Samsung / GlobalFoundries14nm FinFET process is 15 percent smaller, 20 percent faster, and 35 percent more power efficient compared to 20nm processors. This definitely sounds exiting and will bring more performance into phones, tablets, GPUs and will significantly decrease power consumption. The move from 28nm is long overdue.
We believe that Qualcomm’s LTE modem might be the first chip to officially come with this manufacturing process and Apple will probably take most of the 14nm production for an update in its tablets and phones scheduled for 2015.
Applied Materials Makes A Profit
Chip-equipment maker Applied Materials has surprised most of the cocaine nose jobs of Wall Street with a better-than-expected third-quarter profit. It appears that contract manufacturers are spending more on technology used to make smartphone and memory chips.
The company also forecast current-quarter adjusted profit largely above analysts’ average estimate. Chief Executive Gary Dickerson said that demand for DRAM chips is expected to grow in the current quarter.
Applied Materials, which also provides equipment to make flat panel displays and solar cells, forecast an adjusted profit of 25-29 cents per share for the fourth quarter. Wall Street was expecting a profit of 26 cents per share.
Applied Materials expects revenue growth of about 10 to 17 percent, implying revenue of $2.19 billion to $2.33 billion for the quarter. Analysts on average were expecting $2.28 billion. Applied Materials’ net income rose to $301 millionin the third quarter ended July 27, from $168 milliona year earlier. Revenue rose 14.7 percent to $2.27 billion.
Revenue in the company’s silicon systems business, which brings in about two-thirds of total sales, rose 16 percent to $1.48 billion.
AMD’s Carrizo Goes Mobile Only
AMD’s upcoming Carrizo APU might not make it to the desktop market at all.
According to Italian tech site bitsandchips.it, citing industry sources, AMD plans to limit Carrizo to mobile parts. Furthermore the source claims Carrizo will not support DDR4 memory. We cannot confirm or deny the report at this time.
If the rumours turn out to be true, AMD will not have a new desktop platform next year. Bear in mind that Intel is doing the exact same thing by bringing 14nm silicon to mobile rather than desktop. AMD’s roadmap previously pointed to a desktop Carrizo launch in 2015.
AMD’s FM2+ socket and Kaveri derivatives would have to hold the line until 2016. The same goes for the AM3+ platform, which should also last until 2016.
Not much is known about Carrizo at the moment, hence we are not in a position to say much about the latest rumours. AMD’s first 20nm APU will be Nolan, but Carrizo will be the first 20nm big core. AMD confirmed a number of delays in a roadmap leaked last August.
The company recently confirmed its first 20nm products are coming next year. In all likelihood AMD will be selling 32nm, 28nm and 20nm parts next year.
Did Intel Miss The Tablet Boat?
Intel CEO Brian Krzanich has admitted the obvious – Intel missed the boat on tablets.
Speaking at the Code Conference, Krzanich said the company was slow to react to the emergence of tablets and smartphones.
“There was a belief that tablets would be a consumption device only (and) that people would come back to the laptop and the PC. There were heavy debates within Intel and it took a while for us to accept and acknowledge that data. Companies make mistakes,” Krzanich told Walt Mossberg in an interview.
In other words at least part of Intel’s failure to tap the emerging mobile market a few years ago was internal wrangling.
The course shifted under the Krzanich regime. Last Intel President Renee James and Krzanich made it clear that the company is now treating its Atom line-up just like its big cores. For years the company treated Atoms as a sideshow, making sure that they would not eat into Core sales.
ARM had different ideas and so did AMD, they went after the tablet and essential notebook markets. As a result ARM currently dominates the mobile space, while AMD managed to carve a nice niche in the entry-level x86 segment, with Brazos and Kabini parts.
Intel is fighting back, but it is paying a heavy price. The company is on track to quadruple its tablet SoC shipments to 40 million units this year, but it has to pay through the nose to get there. As for the smartphone market, Intel is all but absent.
Krzanich insists he is not giving up on the phone and tablet space. He wants Intel to take a 15 to 20 percent market share in these segments, which sounds very ambitious. Thanks to generous subsidies it has a good chance in the tablet space. This week Intel announced a deal with Rockchip, which should also boost its presence in the booming tablet market in China.
However, so far the company has not rolled out a compelling smartphone SoC and it’s lagging behind the competition in LTE integration.
Intel Links Up With Rockchip
Intel has joined forces with Chinese chip design firm Rockchip to develop next generation processors for the tablet market based on Intel Atom core technology and integrating 3G broadband communications.
Under the terms of the agreement, Intel and Fuzhou Rockchip Electronics (Rockchip) will work together on an Intel branded mobile system on chip (SoC) processor with the intention of enabling a range of entry-level Android tablets.
The chip is expected to ship in the first half of 2015, according to Intel, and will be based on a quad-core Atom processor design integrated with Intel’s 3G modem technology, which the firm gained through its acquisition of Infineon Technologies in 2010.
Rockchip, which is expected to contribute to the integrated graphics technology, will also help Intel bring the product to market faster than might otherwise be the case. The firm is a leading fabless semiconductor design company and already develops mobile SoCs, although its present designs are largely focused around the ARM architecture.
The agreement builds on announcements Intel made at an investor relations day last year, where chief executive Brian Krzanich disclosed the Intel Sofia family, of which the latest chip will form part, and conceded that the chipmaker needed to become more agile in order to gain traction in entry-level markets.
“The strategic agreement with Rockchip is an example of Intel’s commitment to take pragmatic and different approaches to grow our presence in the global mobile market by more quickly delivering a broader portfolio of Intel architecture and communications technology solutions,” Krzanich said.
With this announcement, the Intel Sofia family comprises three products, which are not shipping yet.
A dual-core 3G version is slated for the fourth quarter this year, the quad-core 3G version is due in the first half of 2015, and a version with 4G/LTE communication is also due in the first half of next year.
GPUs Down In Q1
June 5, 2014 by admin
Filed under Around The Net
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According to Jon Peddie Research (JPR), shipments of discrete graphics cards were down in the first quarter of the year. This is in line with seasonal trends, as the market cools down after the holiday season.
The sequential drop was 6.7 percent, which was still better than the overall desktop PC market, which slumped 9 percent. However, on a year-to-year basis add-in-board (AIB) shipments were down 0.8 percent. PC sales were down 1.1 percent.
Nvidia still controls two thirds of the market
Total AIB shipments in Q1 were just 14 million units. AMD and Nvidia both saw their shipments decrease 6.6 percent, so their market share did not change much.
Nvidia controls an estimated 65 percent of the market, up from 64.2 percent last year. AMD’s market share in Q1 was 35 percent, down from 35.6 percent a year ago.
The overall volume remains weak and in the long run things could get even worse, as on-die integrated graphics have already taken a big toll on sales of entry level discrete cards. As integrated GPUs become even faster, they are likely to cannibalize the low end market even further.
JPR points out that the AIB market peaked in 1999, with 114 million units shipped. Last year saw only 65 million units and the stagnant trend is likely to continue this year.
It’s not all bad news for AIBs
Although the slump in discrete GPU shipments is hurting AMD and NV hardware partners, JPR offers a rather encouraging outlook.
It points out that graphics cards are one of the most powerful, essential and exciting components in the PC market today. PC gaming is hardly dead, in fact it is going through what can only be described as a small renaissance. PCs will offer 4K/UHD gaming years ahead of consoles and the Steam Machine concept is looking good, too.
The compute market is another driver, as JPR points out:
“The technology is entering into major new markets like supercomputers, remote workstations, and simulators almost on a daily basis. It would be little exaggeration to say that the AIB resembles the 800-pound gorilla in the room.”
The AIB market is quite a bit less colourful and eventful than it was back in the day, but at least AIBs still have a lot on their hands and they are trying to tap new markets.