Helio X25 was the fastest deca-core 20nm SoC from MediaTek with three cluster designs and this SoC ended up in quite a few prominent China higher end phones including a few Meizu devices. But it looks like customers wanted a bit faster camera, SoC and GPU performance for its late 2016 early 2017 phones, the ones that will launch before the Helio X30 comes to market.

Jeffrey Ju, Executive Vice President and Co-Chief Operating Officer at MediaTek said: “The MediaTek Helio platform fulfills the diverse needs of device makers. Based on the success of MediaTek Helio X20 and X25, we are introducing the upgraded MediaTek Helio X23 and X27. The new SoCs support premium dual camera photography and provide best in-class performance and power consumption,”

The Helio X25 has two Cortex A73 cores clocked at 2.5 GHz, four Cortex A53 clocked at 2.00 GHz and last four Cortex A53 clocked at 1.55GHz. The Mali GT880 graphics is clocked at 850 MHz.

The Helio X20 has two Cortex A73 cores clocked at 2.1 GHz, four Cortex A53 clocked at 1.85 GHz and last four Cortex A53 clocked at 1.4GHz. The Mali GT880 graphics is clocked at 780 MHz.

The newcomer, Helio X27, has two Cortex A73 cores clocked at 2.6 GHz, four Cortex A53 clocked at 2.00 GHz and the last four Cortex A53 clocked at 1.6 GHz. The Mali GT880 graphics is clocked at 875 MHz. The rest of the specification is identical to the Helio X25.

The Helio X23 has two Cortex A73 cores clocked at 2.3 GHz, four Cortex A53 clocked at 1.85 GHz and the last four Cortex A53 clocked at 1.4GHz. The Mali GT880 graphics is clocked at 780 MHz. As you can see, this is just a slightly faster version of Helio X20 and it sits just below Helio X25 with its specs.

Thanks to MediaTek-engineered advancements in the CPU/GPU heterogeneous computing scheduling algorithm, both products deliver more than a 20 percent overall processing improvement and significant increases in web browsing and application launching speeds. This definitely sounds promising but you should bear in mind that MediaTek had enough time to optimize these designs of the new and updated SoCs.

Phones based on the Helio X27 and X23 will be available soon.

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Company co-CEO Mark Liu said that while the fourth quarter could be a bit rough as customers start their inventory adjustments, TSMC’s sales for the quarter will still outperform those for the third quarter.

Talking to Digitimes Lui said that smartphone demand was affected negatively by macroeconomic factors in the first half of 2016. But apparently smartphone chip clients are ordering again in the second half of the year.

TSMC previously estimated its 2016 revenues would grow 5-10 per cent. The foundry expects to meet the high end of the growth guidance, Liu said. In his speech at the CEO Forum of SEMICON Taiwan 2016. Liu claimed that the foundry industry growth is being driven by the markets for smartphones, HPC, automotive and IoT.

Apps like Pokemon G will require more silicon chips used in mobile devices that will be another growth driver in the future, Liu said.

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According to the company the improved management tools address both host (server) managment and virtual client monitoring. Nvidia says that with the new Grid software, admins will be able to get information about the number of virtual graphics instances in use and the number they can potentially create.

They can also see usage information for the stream processors on board each card, the percentage of the card’s frame buffer that’s in use, and the load on each card’s dedicated video encode and decode hardware.

Each guest vGPU instance will tell admins information on encoder and decoder usage, frame buffer occupancy, and the vGPU use. Nvidia adds that it all takes the guess work out of vGPU provisioning and the data it’s exposing about vGPU usage will let system administrators tailor their virtual user profiles better.

All this means that it might stop the admins giving too much processing power to accounts when it is needed for the graphics team. Nvidia thinks those operational improvements will also help lower costs. The August 2016 Grid software update should be available immediately.

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Samsung’s next generation Exynos’ name is very uninspired. You don’t call your much better chip just the Exynos 8895, but that might not be the final name.

The Korean giant went from Exynos 7420 for Galaxy S5 and first 14nm for Android followed a year after with Exynos 8890 still 14nm but witha  custom Exynos M1 “Mongoose” plus Cortex-A53eight core combination.

The new SoC is rumored to come with a 4GHz clock. The same leak suggests that the Snapdragon 830 can reach 3.6 GHz which would be quite an increase from the 2.15Ghz that the company gets with the Snapdragon 820. Samsung’s Exynos 8890 stops at 2.6GHz with one or two cores running while it drops to 2.3 GHz when three of four cores from the main cluster run. Calls us sceptics for this 4GHz number as it sounds like quite a leap from the previous generation.

Let us remind ourselves that the clock speed is quite irrelevant as it doesn’t mean anything, and is almost as irrelevant as an Antutu score. It tells you the maximal clock of a SoC but you really want to know the performance per watt or how much TFlops you can expect in the best case. A clock speed without knowing the architecture is insufficient to make any analysis. We’ve seen in the past that 4GHz processors were slower than 2.5GHz processors.

The fact that Samsung continued to use Snapdragon 820 for its latest greatest Galaxy Note 7 means that the company still needs Qualcomm and we don’t think this is going to change anytime soon. Qualcomm traditionally has a better quality modem tailored well for USA, China, Japan and even the complex Europe or the rest of the world.

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The new test chip contains ARM’s yet-to-be-announced “Artemis” CPU core which is named after a goddess who will turn you into deer and tear you apart with wild dogs if you ever see her. [The NDA must have been pretty tough on this chip.ed]

In fact things have been ticking along on this project for ages. ARM discloses that tapeout actually took place back in December last year and is expecting silicon to come back from the foundry in the following weeks.

ARM actually implemented a full four-core Artemis cluster on the test chip which should show vendors what is possible for their production designs. The test chip has a current generation Mali GPU implementation with 1 shader core to show vendors what they will get when they use ARM’s POP IP in conjunction with its GPU IP. There is also a range of other IP blocks and I/O interfaces that are used to validation of the new manufacturing process.

TSMC’s 10FF manufacturing process is supposed to increase density with scaling’s of up to 2.1x compared to the previous 16nm manufacturing node. It also brings about 11-12 per cent higher performance at each process’ respective nominal voltage, or a 30 per cent reduction in power.

ARM siad that comparing a current Cortex A72 design on 16FF+ and an Artemis core on 10FF on the new CPU and process can halve the dynamic power consumption. Currently clock frequencies on the new design are still behind the older more mature process and IP, but ARM expects this to improve as it optimizes its POP and the process stabilizes.

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Digitimes’ deep throats claimed TSMC is expected to achieve certification on its 10nm process in the fourth quarter of 2016, and deliver product samples to the customer for validation in the first quarter of 2017.

This means that TSMC could begin small-volume production for Apple’s A11 chips as early as the second quarter of 2017 and building the chips will likely start to generate revenues at TSMC in the third quarter. The A11-series processor will power the iPhone models slated for launch in the second half of 2017.

TSMC is expected to get two-thirds of the overall A11 chip orders from Apple.

The company is officially refusing to comment on Digitimes’ story, but it does fit into what we have already been told about Jobs’ Mob’s plans for next year.

For TSMC, Q1 2016 was marked by a reduction of demand for high-end smartphones, while smartphone demand in China and emerging markets had upward momentum. Beginning Q2 2016 and onward, the company expect to get back onto a growth trajectory and is projected to hit a 5 to 10 percent growth rate in 2016.

“Our 10-nanometer technology development is on track,” said company president and co-CEO Mark Liu during the company’s Q4 2015 earnings call. “We are currently in intensive yield learning mode in our technology development. Our 256-megabit SRAM is yielding well. We expect to complete process and product qualification and begin customer product tape-outs this quarter.”

“Our 7-nanometer technology development progress is on schedule as well. TSMC’s 7 nanometer technology development leverage our 10-nanometer development very effectively. At the same time, TSMC’s 7-nanometer offers a substantial density improvement, performance improvement and power reduction from 10-nanometer.

These two technologies, 10-nanometer and 7-nanometer, will cover a very wide range of applications, including application processors for smartphone, high-end networking, advanced graphics, field-programmable gate arrays, game consoles, wearables and other consumer products.”

In Q1 2016, TSMC reached a gross margin of 44.9 percent, an operating margin of 34.6 percent and a net profit margin of 31.8 percent respectively. Going forward into Q2 2016, the company is expecting revenue between ~$6.65 billion and ~$6.74 billion USD, gross margins between 49 and 51 percent, and operating profit margins between 38.5 and 40.5 percent, respectively.

Chips used for communications and industrial uses represented over 80 percent of TSMC’s revenue in FY 2015. The company was also able to improve its margins by increasing 16-nanometer production, and like many other semiconductor companies, is preparing for an expected upswing sometime in 2017.

In February, a 6.4-magnitude earthquake struck southern Taiwan where TSMC’s 12-inch Fab 14 is located, a current site of 16-nanometer production. The company expected to have a manufacturing impact above 1 percent in the region with a slight reduction in wafer shipments for the quarter.

“Although the February 6 earthquake caused some delay in wafer shipments in the first quarter, we saw business upside resulting from demand increases in mid- and low-end smartphone segments and customer inventory restocking,” said Lora Ho, Senior Vice President and Chief Financial Officer of TSMC.

“We expect our business in the second quarter will benefit from continued inventory restocking and recovery of the delayed shipments from the earthquake.”

In fiscal year 2016, the company will spend between $9 and $10 billion on ramping up the 16-nanometer process node, constructing Fab 15 for 12-inch wafers in Nanjing, China, and beginning commercial production of the 10-nanometer FinFET process at this new facility. Samsung and Intel are also expected to start mass production of 10-nanometer products by the end of 2016.

During its Q4 2015 earnings call, company president and co-CEO Mark Liu stated the company is currently preparing and working on a 7-nanometer process node and plans to begin volume production sometime in 2018. Meanwhile, since January 2015, a separate research and development team at TSMC has been laying the groundwork for a 5-nanometer process which the company expects to bring into commercial production sometime in 1H 2020.

So far in Q1 2016, shipments of 16 and 20-nanometer wafers have accounted for around 23 percent of the company’s total wafer revenues.

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At the GDC 2016 show in San Francisco, Razer has announced that the Core will be ready in April and have a price of US $499. As expected, it has been only validated on Razer Blade Stealth and the newly introduced Razer Blade 2016 Edition notebooks but as it uses Thunderbolt 3 interface, it should be compatible with any other notebook, as long as manufacturer wants it.

With dimensions set at 105 x 353 x 220mm, the Razer Core is reasonably portable. It comes with a 500W PSU and features four USB 3.0 ports, Gigabit Ethernet and Thunderbolt 3 port which is used to connect it to a notebook.

As far as graphics cards support is concerned, Razer says that the Core will work with any AMD Radeon graphics card since Radeon 290 series, including the latest R9 Fury, R9 Nano and Radeon 300 series, as well as pretty much all Nvidia Maxwell GPU based graphics cards since Geforce GTX 750/750 Ti, although we are not sure why would you pair up a US $500 priced box with a US $130 priced graphics cards. The maximum TDP for the graphics card is set at 375W, which means that all dual-GPU solutions are out of the picture, so it will go as far as R9 Fury X or the GTX Titan X.

There aren’t many notebooks that feature a Thunderbolt 3 ports and we have heard before that Thunderbolt 3 might have certain issues with latency, which is probably why other manufacturers like MSI and Alienware, went on with their own proprietary connectors. Of course, Razer probably did the math but we will surely keep a closer eye on it when it ships in April. Both AMD and Nvidia are tweaking their drivers and already have support for external graphics, so it probably will not matter which graphics card you pick.

According to Razer, the Razer Core will be available in April and priced at US $499. Razer is already started taking pre-orders for the Razer Core and offers a US $100 discount in case you buy it with one of their notebooks, Razer Blade 2016 or Blade Stealth.

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According to Digitimes it fell to less than 30 million units in 2015 and the outfit suffering most was  AMD. The largest graphics card player Palit Microsystems, which has several brands including Palit and Galaxy, shipped 6.9-7.1 million graphics cards in 2015, down 10 per cent  on year. Asustek Computer shipped 4.5-4.7 million units in 2015, while Colorful shipped 3.9-4.1 million units, and is aiming to raise its shipments by 10 per cent  on year in 2016.

Micro-Star International (MSI) enjoyed healthy graphics card shipments at 3.45-3.55 million in 2015, up 15 per cent  on year, and EVGA, which has tight partnerships with Nvidia, also saw a significant shipment growth, while Gigabyte suffered from a slight drop on year. Sapphire and PowerColor suffered dramatic drops in shipments in 2015.

There are fears that several of the smaller GPU makers could be forced out of the market after AMD gets its act together with the arrival of Zen and Nvidia’s next-generation GPU architectures launch later in 2016.

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It is starting to look sales teams for the pair are each trying to show that they can use the technology to reduce the most electricity consumption and production costs.

In its yearly result for 2015, TSMC made an announcement that it is planning to enter mass-production system of chips produced by 16-nano FinFET Compact (FFC) process sometime during 1st quarter of this year. TSMC had finished developing 16-nano FFC process at the end of last year. During the announcement TSMC talked up the fact that its 16-nano FFC process focuses on reducing production cost more than before and implementing low electricity.

TSMC is apparently ready for mass-production of 16-nano FFC process sometime during 1st half of this year and secured Huawei’s affiliate called HiSilicon as its first customer.

HiSilicon’s Kirin 950 that is used for Huawei’s premium Smartphone called Mate 8 is produced by TSMC’s 16-nano FF process. Its A9 Chip, which is used for Apple’s iPhone 6S series, is mass-produced using the 16-nano FinFET Plus (FF+) process that was announced in early 2015. By adding FFC process, TSMC now has three 16-nano processors in action.

Samsung is not far behind it has mass-produced Gen.2 14-nano FinFET using a process called LPP (Low Power Plus). This has 15 per cent lower electricity consumption compared to Gen.1 14-nano process called LPE (Low Power Early).

Samsung Electronics’ 14-nano LPP process was seen in the Exynos 8 OCTA series that is used for Galaxy S7 and Qualcomm’s Snapdragon 820. But Samsung Electronics is also preparing for Gen.3 14-nano FinFET process.

Vice-President Bae Young-chang of Samsung’s LSI Business Department’s Strategy Marketing Team said it will use a process similar to the Gen.2 14-nano process.

Both Samsung and TSMC might have a few problems. It is not clear what the yields of these processes are and this might increase the production costs.

Even if Samsung Electronics and TSMC finish developing 10-nano process at the end of this year and enter mass-production system next year, but they will also have to upgrade their current 14 and 16-nano processes to make them more economic.

Even if 10-nano process is commercialized, there still will be many fabless businesses that will use 14 and 16-nano processes because they are cheaper. While we might see a few flagship phones using the higher priced chips, it might be that we will not see 10nm in the majority of phones for years.

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