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Is Samsung The King Of LTE?
June 24, 2015 by admin
Filed under Network Services
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Samsung Electronics has told the world that owns the largest number of patent rights essential for long-term evolution (LTE) technology in the world.
Writing in its official blog “Samsung Tomorrow” that it has more than 3,600 standard essential patents (SEP) for the LTE and LTE-Advanced (LTE-A) technology. That is 17 percent of all LTE-related SEPs.
We guess this means that if someone buys an LTE phone more than 17 per cent of the money which goes to buy patents should end up in Samsung’s bank account.
Samsung Electronics Digital Media & Communication Laboratory’s intellectual property application team head Lee Heung-mo said Samsung Electronics has established a solid foothold as the global leader and the first mover in the fourth-generation mobile telecom market.
“This also means that the company has become able to provide more convenience to customers by developing the latest technologies.”
The Taiwanese patent office conducted market research for the nation’s state-run National Applied Research Laboratory based on about 6,000 patent rights listed at the Patent and Trademark Office in the United States during the last two years.
LG Electronics and Qualcomm followed Samsung Electronics in second place with 14 percent of SEPs, each. Ericsson, Panasonic, Nokia and NTT DoCoMo hold the third spot with 5 percent, each.
Pantech, the nation’s third-largest handset maker which currently faces bankruptcy, held only one percent, while Korea’s state-run Electronics and Telecommunications Research Institute owned less than 1 percent, the report showed.
During the patent dispute with Apple, the U.S. International Trade Commission said Apple had infringed on Samsung Electronics’ SEPs though they had to be shared under a “fair, reasonable and non-discriminatory” principle.
Samsung Electronics said it has pushed for securing the SEPs in this sector during the last 18 years and has competed with global telecom giants including Qualcomm, Nokia and Ericsson as a relative latecomer. It said securing leadership in SEPs may change the crisis of facing patent disputes to diversifying income sources.
MediaTek Debuts Contactless Heart Rate Monitor
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While MediaTek might be known for its multi-core smartphone processors, the firm was very keen to show off its more adventurous side at Computex 2015.
With a booth almost entirely dedicated to the latest and greatest from its new Labs division, which aims to bring the latest innovations from developers to market, MediaTek offered something a little more unexpected compared to previous years.
Launched in autumn last year, MediaTek Labs is a worldwide initiative to help developers of any background or skill level to create and market wearable and Internet of Things (IoT) devices.
With the firm’s LinkIt Development Platform, based on the MediaTek Aster (MT2502) chipset, sitting at its core, the Labs programme provides developers, makers and service providers with both software and hardware development kits, technical documentation and business support.
Here’s a few of our favourite innovations showed off at Computex, based on either the LinkIt One platform, or the firm’s fresh Helio P10 smartphone family of SoCs.
Heart rate monitoring smartphone camera
This “contactless heartrate monitoring” technology is powered by the firm’s Visual Processing Application in its latest P10 smartphone SoC.
It makes use of a smartphone’s video camera to take a heart rate reading via the front-facing camera by stripping down the layers of the image taken by the camera in real-time to detect the pulse in a user’s temple.
We were rather dubious about how well this might work, so gave it a go. While it took a good few seconds to match up, you can see from the photo that it is almost as accurate as the portable ECG monitoring device we had clipped on our finger. Impressive stuff.
Wine brewer
Winning first prize in the ITRI Mobilehero competition in Taiwan last year, this nifty IoT wine brewing device was developed by a local start-up called Alchema.
It consists of five sensors thatmonitor the alcohol content and the brewing environment. The results we tasted were, shall we say, interesting, if a little on the sharp side.
Alchema looking to raise more funds on Kickstarter before the end of the year.
Another LinkIt-powered device MediaTek showed off at Computex was a wearable aimed for the elderly. Using Bluetooth and accelerometer sensors, the wristband tracker detects the users’ wrist motions and raises an alarm, alerting those that are linked to the watch via a smartphone app if their elderly family member, loved one or friend’s device has detected a sudden movement that could resemble a fall or accident.
Sitting at the more mature end of the LinkIt developer platform spectrum, but still less than a year old, is an electric-scooter rental company called Skuro Moto. We spoke to its chief executive Frank Chen, who is running the company at the tender age of 24 after developing the idea while at university.
Skuro works with electric-vehicle maker Ahamani EV Technology to provide a rental service at Yuan Ze University in Taiwan. The bikes reduce costs for riders by about 30 percent thanks to a monitoring system enabled by the LinkIt chip that lets riders see their power usage. They can also be started by a swipe of a student identity card, to save the trouble of lost keys.
TSMC Moving To 16FF+ Soon
TSMC’s 16nm FinFET process has barely gotten off the ground, but the foundry is already talking about 16nm FinFET Plus, which is due to launch by the end of the year.
The improved 16nm FinFET Plus (16FF+) node is supposed to deliver more efficiency and performance, making TSMC’s node more competitive compared to Samsung’s 14nm node. That is the general idea, but TSMC’s first generation 16nm node has failed to impress in terms of design wins.
TSMC president CC Wei said the new 16FF+ node already has 20 tapeouts, ten of which achieved satisfactory yield performance. Wei said the company expects up to 50 tapeouts by the end of the year. TSMC expects 16FF+ to enter commercial production in the second half of the year.
16FF+ is not the only FinFET node coming from TSMC over the next year. The company plans to introduce 16FFC for compact devices sometime in the second half of 2016. In addition, 10nm FinFET is expected to enter risk production by the end of 2015, reports Digitimes.
Can TSMC Beat Samsung?
TSMC has said that it is confident that it can beat Samsung Electronics in ramping up production on its 10nm lines.
Samsung disclosed during a recent technology forum in the US that the company plans to enter mass production of chips using its 10nm FinFET process by the end of 2016,.
But in a statement TSMC claimed it could the outfit said the way things are shaping up it could beat that time table. TSMC continued that in the 10nm FinFET race, Intel will be its major competitor.
We expect to hear a bit more about TSMC’s plans at its Taiwan Technology Symposium 2015 on May 28. At the upcoming event, the foundry is expected to talk about the progress and development of its FinFET manufacturing nodes.
TSMC chairman Morris Chang remarked earlier in 2015 that TSMC expects to gain a majority of market share in the FinFET segment in 2016.
Intel is also expected to release its first chips made using 10nm process technology as early as in the middle of 2016.
Chipmakers Advocating MIPS Open Source Moves
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Qualcomm Atheros, Lantiq (part of Intel) and Broadcom have joined the Prpl Foundation.
For those who came in late Prple is the organisation set-up by Imagination Technologies to support open-source software on the MIPS architecture.
The big names follow CUPP Computing, Elliptic Technologies, Imperas Software, Kernkonzept and Seltech joined the foundation at lower levels.
In a statement the Foundation said that the newcomers to the prpl Foundation’s board of directors will participate at the executive level and appoint representatives to the technical steering committee and to engineering groups including the security.
So in other words the key players will be advocating an open source approach to MIPS.
Prpl, is open to other architectures, and focuses on “datacenter-to-device portable software and visualized architectures”, it said. Initial domains oem its hit list are: datacenter, networking, storage, connected consumer, embedded and IoT.
MidiaTek Developing Two SoC’s for Tablets
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MediaTek is working on two new tablet SoCs and one of them is rumored to be a $5 design.
The MT8735 looks like a tablet version of Mediatek’s smartphone SoCs based on ARM’s Cortex-A53 core. The chip can also handle LTE (FDD and TDD), along with 3G and dual-band WiFi. This means it should end up in affordable data-enabled tablets. There’s no word on the clocks or GPU.
The MT8163 is supposed to be the company’s entry-level tablet part. Priced at around $5, the chip does not appear to feature a modem – it only has WiFi and Bluetooth on board. GPS is still there, but that’s about it.
Once again, details are sketchy so we don’t know much about performance. However, this is an entry-level part, so we don’t expect miracles. It will have to slug it out with Alwinner’s $5 tablet SoC, which was announced a couple of months ago
According to a slide published by Mobile Dad, the MT8753 will be available later this month, but we have no timeframe for the MT8163.
But there’s nothing to see here as far as Torvalds is concerned. It’s just another day in the office. And all this in “Back To The Future II” year, as well.
Meanwhile under the bonnet, the community are already slaving away on Linux 4.1 which is expected to be a far more extensive release, with 100 code changes already committed within hours of Torvalds announcement of 4.0.
But there is already some discord in the ranks, with concerns that some of the changes to 4.1 will be damaging to the x86 compatibility of the kernel. But let’s let them sort that out amongst themselves.
After all, an anti-troll dispute resolution code was recently added to the Linux kernel in an effort to stop some of the more outspoken trolling that takes place, not least from Torvalds himself, according to some members of the community.
Will Intel Challenge nVidia In The GPU Space?
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Intel has released details of its next -generation Xeon Phi processor and it is starting to look like Intel is gunning for a chunk of Nvidia’s GPU market.
According to a briefing from Avinash Sodani, Knights Landing Chief Architect at Intel, a product update by Hugo Saleh, Marketing Director of Intel’s Technical Computing Group, an interactive technical Q&A and a lab demo of a Knights Landing system running on an Intel reference-design system, Nvidia could be Intel’s target.
Knights Landing and prior Phi products are leagues apart and more flexible for a wider range of uses. Unlike more specialized processors, Intel describes Knights Landing as taking a “holistic approach” to new breakthrough applications.
The current generation Phi design, which operates as a coprocessor, Knights Landing incorporates x86 cores and can directly boot and run standard operating systems and application code without recompilation.
The test system had socketed CPU and memory modules was running a stock Linux distribution. A modified version of the Atom Silvermont x86 cores formed a Knights Landing ’tile’ which was the chip’s basic design unit consisting of dual x86 and vector execution units alongside cache memory and intra-tile mesh communication circuitry.
Each multi-chip package includes a processor with 30 or more tiles and eight high-speed memory chips.
Intel said the on-package memory, totaling 16GB, is made by Micron with custom I/O circuitry and might be a variant of Micron’s announced, but not yet shipping Hybrid Memory Cube.
The high-speed memory is similar to the DDR5 devices used on GPUs like Nvidia’s Tesla.
It looks like Intel saw that Nvidia was making great leaps into the high performance arena with its GPU and thought “I’ll be having some of that.”
The internals of a GPU and Xeon Phi are different, but share common ideas.
Nvidia has a big head start. It has already announced the price and availability of a Titan X development box designed for researchers exploring GPU applications to deep learning. Intel has not done that yet for Knights Landing systems.
But Phi is also a hybrid that includes dozens of full-fledged 64-bit x86 cores. This could make it better at some parallelizable application categories that use vector calculations.
Intel Shows Off The Xeon SoC
Intel has announced details of its first Xeon system on chip (SoC) which will become the new the Xeon D 1500 processor family.
Although it is being touted as a server, storage and compute applications chip at the “network edge”, word on the street is that it could be under the bonnet of robots during the next apocalypse.
The Xeon D SoCs use the more useful bits of the E3 and Atom SoCs along with 14nm Broadwell core architecture. The Xeon D chip is expected to bring 3.4x better performance per watt than previous Xeon chips.
Lisa Spelman, Intel’s general manager for the Data Centre Products Group, lifted the kimono on the eight-core 2GHz Xeon D 1540 and the four-core 2.2GHz Xeon D 1520, both running at 45W. It also features integrated I/O and networking to slot into microservers and appliances for networking and storage, the firm said.
The chips are also being touted for industrial automation and may see life powering robots on factory floors. Since simple robots can run on basic, low-power processors, there’s no reason why faster chips can’t be plugged into advanced robots for more complex tasks, according to Intel.
AMD Goes Virtual With Liquid VR
AMD Liquid VR is not a retail product – it is an initiative to develop and deliver the best Virtual Reality (VR) experience in the industry.
AMD Liquid VR was announced at the Game Developers Conference in San Francisco, and the company describes it is a “set of innovative technologies focused on enabling exceptional VR content development” for hardware based on AMD silicon.
Developers will soon get access to the LiquidVR SDK, which will help them address numerous issues associated with VR development.
Platform and software rather than hardware
If you were expecting to see a sexy AMD VR headset with a killer spec, the announcement may be disappointing. However, if you are a “what’s under the bonnet” kind of geek, there are a few interesting highlights.
AMD has put a lot of effort into minimising motion-to-photon latency, which should not only help improve the experience, but also keep you from experiencing motion sickness, or hurling over that new carpet that really ties the room together.
Headline features of LiquidVR SDK 1.0 include:
Async Shaders for smooth head-tracking enabling Hardware-Accelerated Time Warp, a technology that uses updated information on a user’s head position after a frame has been rendered and then warps the image to reflect the new viewpoint just before sending it to a VR headset, effectively minimizing latency between when a user turns their head and what appears on screen.
Affinity Multi-GPU for scalable rendering, a technology that allows multiple GPUs to work together to improve frame rates in VR applications by allowing them to assign work to run on specific GPUs. Each GPU renders the viewpoint from one eye, and then composites the outputs into a single stereo 3D image. With this technology, multi-GPU configurations become ideal for high performance VR rendering, delivering high frame rates for a smoother experience.
Latest data latch for smooth head-tracking, a programming mechanism that helps get head tracking data from the head-mounted display to the GPU as quickly as possible by binding data as close to real-time as possible, practically eliminating any API overhead and removing latency.
Direct-to-display for intuitively attaching VR headsets, to deliver a seamless plug-and-play virtual reality experience from an AMD Radeon™ graphics card to a connected VR headset, while enabling features such as booting directly to the display or using extended display features within Windows.
You can grab the full AMD LiquidVR presentation here. (pdf)
What’s next for LiquidVR?
It all depends on what you were expecting, and what the rest of the industry does. AMD hopes LiquidVR will be compatible with a broad range of VR devices. LiquidVR will allow hardware makers to implement AMD technology in their products with relative ease, enabling 100Hz refresh rates, the use of individual GPUs per each eye and so on.
To a certain extent, you can think of LiquidVR as FreeSync for VR kit.
Oculus CEO Brendan Irbe said achieving presence in a virtual world is one of the most important elements needed to deliver a good user experience.
He explained where AMD comes in:
“We’re excited to have AMD working with us on their part of the latency equation, introducing support for new features like asynchronous timewarp and late latching, and compatibility improvements that ensure that Oculus’ users have a great experience on AMD hardware.”
Raja Koduri, corporate vice president, Visual Computing, AMD, said content, comfort and compatibility are the cornerstones of AMD’s focus on VR.
AMD’s resident graphics guru said:
“With LiquidVR we’re collaborating with the ecosystem to unlock solutions to some of the toughest challenges in VR and giving the keys to developers of VR content so that they can bring exceptional new experiences to life.”
A picture is worth a thousand words, so here’s 3300 frames of AMD’s virtual reality vision.
Can MediaTek Take On Qualcomm?
While Qualcomm’s 20nm Snapdragon 810 SoC might be the star of upcoming flagship smartphones, it appears that MediaTek has its own horse for the race, the octa-core MT6795.
Spotted by GforGames site, in a GeekBench test results and running inside an unknown smartphone, MediaTek’s MT6795 managed to score 886 points in the single-core test and 4536 points in the multi-core test. These results were enough to put it neck to neck with the mighty Qualcomm Snapdragon 810 SoC tested in the LG G Flex 2, which scored 1144 points in the single-core and 4345 in the multi-core test. While it did outrun the MT6795 in the single-core test, the multi-core test was clearly not kind on the Snapdragon 810.
The unknown device was running on Android Lollipop OS and packed 3GB of RAM, which might gave the MT6795 an edge over the LG G Flex 2.
MediaTek’s octa-core MT6795 was announced last year and while we are yet to see some of the first design wins, recent rumors suggested that it could be powering Meizu’s MX5, HTC’s Desire A55 and some other high-end smartphones. The MediaTek MT6795 is a 64-bit octa-core SoC clocked at up to 2.2GHz, with four Cortex-A57 cores and four Cortex-A53 cores. It packs PowerVR G6200 graphics, supports LPDDR3 memory and can handle 2K displays at up to 120Hz.
As we are just a few days from Mobile World Congress (MWC) 2015 which will kick off in Barcelona on March 2nd, we are quite sure that we will see more info as well as more benchmarks as a single benchmark running on an unknown smartphone might not be the best representation of performance, it does show that MediaTek certainly has a good chip and can compete with Qualcomm and Samsung.