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Qualcomm Updates The S4 Series
Qualcomm’s Snapdragon S4 chips are proving to be quite a coup for the company. They are faster than anything the competition has to offer, more power efficient and some versions include integrated LTE. The only problem is that Qualcomm is having trouble meeting demand.
Qualcomm announced four new S4 chip series aimed at wildly different market segments, all based on the very successful Krait architecture.
Snapdragon S4 Prime chips will target smart TVs and similar applications. The first Prime part is the MPQ8054, a 1.5GHz quad-core with Adreno 320 graphics. Qualcomm promises “leading” audio/video capabilities and low power consumption, although we are not sure efficiency very important in TVs.
Meanwhile Snapdragon S4 Pro parts sound like all-rounders. They also feature Adreno 320 graphics and the S4 Pro tier includes the APQ8064 quad-core and MSM8960T, the Pro version of MSM8960. Pro parts are likely to end up in tablets, hybrids and other “ultra-thin and sleek” devices.
S4 Plus parts are geared towards the traditional mobile market, smartphones and tablets, ranging from the low-end to the high-end. Processors in the S4 Plus tier include MSM8960, APQ8060A, MSM8660A, MSM8260A, APQ8030, MSM8930, MSM8630, MSM8230, MSM8627 and MSM8227.
Is Samsung Pursuing The Server Market?
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It is certain that Korean electronics giant Samsung will soon be entering the server chip market.
Reports are coming in that the company has been picking up key server personnel from Intel and AMD. Samsung has been focused on developing ARM chips and stayed clear of the x86 architecture used by Intel and AMD.
But the companies latest hires seem to indicate that might change.
Samsung’s latest recruits include veterans of the chip business like Jim Mergard, Frank Helms, who is a Fusion APU architect, Brad Burgess who designed the Bobcat APU and Patrick Patla (VP of AMD’s server business). Patla was behind the success of the Opteron chip set and has done well using the x86-server system.
Hitachi Bringing New Xeon Servers To Market
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Hitachi Data Systems announced that it will expand its family of blade and rack server products for the enterprise market. The forthcoming Hitachi Compute Systems will be based on the new Intel Xeon processor E5-2600 family.
Roberto Basilio, vice president, Infrastructure Platforms Product Management, Hitachi Data Systems said that by leveraging the new Intel Xeon processor E5 family, upcoming Hitachi Compute Systems will feature faster performance, higher density and greater energy efficiency. The servers are being designed for converged data centres. They come pre-configured and optimised for leading applications such as Microsoft Exchange 2010, SAP HANA and solutions with VMware.
He said that the Intel Xeon processor E5-2600 product family provides exceptional energy efficiency, increased security, flexible performance and the opportunity for streamlining customer’s data centres. The current range of Hitachi Compute Systems consists of two blade server product lines, Hitachi Compute Blade 2000 and Hitachi Compute Blade 320, both of which are intended for high performance, high availability applications. The portfolio also includes a family of rack-optimised servers, Hitachi Compute Rack, that are the foundation for dedicated, packaged solutions such as the company’s award-winning object store, Hitachi Content Platform (HCP).
Will Samsung Release A Quad-Core Processor?
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Samsung is reportedly developing a new quad-core chip that will power its next generation Galaxy series flagship smartphone.
According to androidandme.com, the Korean giant is preparing a new 32nm quad-core chip, the Exynos 4412. The new chip is based on the A9 architecture and it will run at speeds of up to 1.5GHz. Moreover, Samsung went for ARM Mali-400 graphics in the current Exynos 4210, so there is a good chance the new chip will include next generation Mali-604 graphics.
In terms of performance, the new chip could be a rather impressive beast. Compared to Nvidia’s Tegra 3, the Exynos could squeeze out a bit more performance per watt, thanks to its superior manufacturing process. On the graphics front, it could also sneak ahead of both Tegra 3 and Apple’s A5, with the SGX 543MP2 graphics core. The new chip should debut in early 2012 if all goes well.
Interestingly, Samsung has been keen to embrace processors and graphics solutions from a number of companies in the past. Even now, the company is selling a rather awkward mix of phones and tablets based on Samsung, Nvidia, Qualcomm and Texas Instruments chips. Basically Samsung is in bed with everyone, but it is obviously taking mobile chip development seriously and we could see some if not all third-party suppliers phased out sometime in the future.
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Intel Gives Details On Their Xeon E5 Processors
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Intel finally gave more details at the supercomputing conference SC2011 about its upcoming Xeon E5 processors and been showing off its Knights Corner many integrated core (MIC) solution.
We don’t expect to see the new Xeons until the first half of 2012, but Intel has has been shipping the new chips to “a small number of cloud and HPC customers” since September. The E5 family has the same core as the 3960X which Intel launched this week. So far though Intel does not seem to be keen to ramp up any mass production. Some of this might have something to do with problems in production which were rumoured earlier this year. However early benchmarks indicate that it could be a winner.
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AMD Ships One Million Llano Processors
It appears that AMD has successfully managed to ship one million Llano chips in the second quarter, which is weeks ahead of the official launch.
AMD released the news during its earnings conference call. Where interim CEO Thomas Seifert said demand for Llano was strong. “We expect Llano ramp to outpace the Brazos ramp,” he noted.
If you look back at AMD’s Brazos launch, they managed to ship around one million units ahead of its scheduled launch, in the fourth quarter of 2010. Conversely, introducing Llano will be a bit more challenging, because AMD is planning to offer many varieties of mobile and desktop SKUs; including affordable dual- and triple-core processors. Therefore, Llano is expected to outpace Brazos very soon. AMD also made mention in their earnings call that total APU shipments for the quarter hit seven million. That said, so 6 million of them were Brazos processors.
It is believed that AMD Llano chip will take 50 percent of their total CPU shipments by the end of the year. In the first quarter of 2012, the Llano is expected to garner over 60 percent of their shipments.
AMD A75 Motherboards Economically Priced
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It appears that AMD’s A75 motherboards have finally started to hit the streets. Furthermore, we were truly shocked to see these MB’s economically priced for about $60.00.
Do not get too over excited in reference to the pricing because this gets you a decent A75 micro-ATX motherboard with up to four USB 3.0 ports and six SATA 6Gbps ports matched with a FM1 socket. It’s also worth pointing out that you will not get these same features like USB 3.0 and SATA 6Gbps on a comparable Intel platform in the same price range; you’d pay more.
We noticed that online retailer Newegg.com has an AMD motherboard selling for $59.99 after the rebate; otherwise it will cost $72.99. We expect the more serious computer geeks to opt for more muscle in regards to their motherboards; so they can whet their appetite for a good A75 for about $150.00.
Gigabyte Debuts New Motherboards
July 14, 2011 by admin
Filed under Uncategorized
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Gigabyte just announced their new slate of motherboards that will support AMD’s A75 series chipsets and the latest AMD A-Series APUs or Llano. The new A75 based motherboards are said to offer DIY PC builders and developers a higher level of 3D and multimedia performance that is scalable and said to offer the best value upgrade path imaginable.
Gigabyte’s VP of Service and Marketing Henry Kao is quoted as saying that the new boards were new and exciting as AMD new APU’s were “ground breaking” APU technology. As well as bringing AMD A-Series technology to DIY users who demand excellent gaming and multimedia performance on a budget, these motherboards also offer a compelling upgrade path that includes Dual Graphics configurations.
The A75 motherboards from Gigabyte feature an AMD A75 ‘Hudson’ chipset supporting the latest 32 nanometer AMD A-Series APUs. That said, these chips are the first ever to combine a DX11-capable, high performance graphics processor with the option of a dual or quad core CPU on one silicon die, offering a 3D gaming and multimedia experience which is similar to a discrete graphics configuration.
TSMC May Beat Intel To Market With 3D Chip
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Taiwan Semiconductor Manufacturing Co. is competing with Intel to become the first technology firm to offer three-dimensional chips that boost the density of transistors in a single semiconductor by up to 1000 times.
TSMC, the world’s largest contract chip maker, could make its first 3D chips commercially available before the end of 2011, according to a person close to the situation who wishes to remain anonymous.
The time frame for TSMC matches the end of 2011 schedule that Intel has set for the launch of its 3D Tri-Gate chips, which the company expects to be the world’s first commercial 3D chip and the most significant advance in chip technology since the development of the chip transistor in the 1950s.
With several layers of silicon stacked together, a 3D chip can achieve performance gains of about a third while consuming 50% less power. For this reason, 3D chips are particularly well suited to power new generations of mobile devices such as tablets and mobile phones, businesses where Intel has so far failed to establish a significant presence.
“This is definitely a new business opportunity for TSMC,” said Shang-Yi Chiang, senior vice president for R&D at TSMC, in an interview. “We are building a patent portfolio now.”
3D chips are expected to solve a number of problems for chipmakers who are aiming for performance increases in ever-smaller chips. As transistor density rises, the wires connecting them have become both thinner and closer together, resulting in increased resistance and overheating. These problems cause signal delays, limiting the clock speed of central processing units.
“3D chips look more attractive because of their greater density,” Chiang said. “However, it is more difficult to make them because of the testing issues. If you have five stacked dies and one of the dies is bad, you have to scrap the whole thing.”
2GHz Smartphones On The Horizon
April 19, 2011 by admin
Filed under Smartphones
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According to Asian sources, Samsung is apparently developing an ARM based 2GHz dual-core processor. The smartphone is expected to be the first on the market next year about of the Samsung’s Exynos line.
Apparently, this news was leaked from an executive at Samsung who also said the company intends to offer the new processors on its competitors to put on their smartphones and tablets. Samsung is also claiming that the processor will offer PC performance. Our question is what will the performance be based upon?