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ARM Shows Off 10nm Chip
ARM’s collaboration with TSMC has finally born some fruit with the tapeout of a 10nm test chip to show off the company’s readiness for the new manufacturing process.
The new test chip contains ARM’s yet-to-be-announced “Artemis” CPU core which is named after a goddess who will turn you into deer and tear you apart with wild dogs if you ever see her. [The NDA must have been pretty tough on this chip.ed]
In fact things have been ticking along on this project for ages. ARM discloses that tapeout actually took place back in December last year and is expecting silicon to come back from the foundry in the following weeks.
ARM actually implemented a full four-core Artemis cluster on the test chip which should show vendors what is possible for their production designs. The test chip has a current generation Mali GPU implementation with 1 shader core to show vendors what they will get when they use ARM’s POP IP in conjunction with its GPU IP. There is also a range of other IP blocks and I/O interfaces that are used to validation of the new manufacturing process.
TSMC’s 10FF manufacturing process is supposed to increase density with scaling’s of up to 2.1x compared to the previous 16nm manufacturing node. It also brings about 11-12 per cent higher performance at each process’ respective nominal voltage, or a 30 per cent reduction in power.
ARM siad that comparing a current Cortex A72 design on 16FF+ and an Artemis core on 10FF on the new CPU and process can halve the dynamic power consumption. Currently clock frequencies on the new design are still behind the older more mature process and IP, but ARM expects this to improve as it optimizes its POP and the process stabilizes.
Courtesy-Fud
TSMC’s FinFet Coming In 2015?
TSMC has announced that it will begin volume production of 16nm FinFET products in the second half of 2015, in late Q2 or early Q3.
For consumers, this means products based on TSMC 16nm FinFET silicon should appear in late 2015 and early 2016. The first TSMC 16nm FinFET product was announced a few weeks ago.
TSMC executive CC Wei said sales of 16nm FinFET products should account for 7-9% of the foundry’s total revenue in Q4 2015. The company already has more than 60 clients lined up for the new process and it expects 16nm FinFET to be its fastest growing process ever.
Although TSMC is not talking about the actual clients, we already know the roster looks like the who’s who of tech, with Qualcomm, AMD, Nvidia and Apple on board.
This also means the 20nm node will have a limited shelf life. The first 20nm products are rolling out as we speak, but the transition is slow and if TSMC sticks to its schedule, 20nm will be its top node for roughly a year, giving it much less time on top than earlier 28nm and 40nm nodes.
The road to 10nm
TSMC’s 16nm FinFET, or 16FinFET, is just part of the story. The company hopes to tape out the first 10nm products in 2015, but there is no clear timeframe yet.
Volume production of 10nm products is slated for 2016, most likely late 2016. As transitions speed up, TSMC capex will go up. The company expects to invest more than $10bn in 2015, up from $9.6bn this year.
TSMC expects global smartphone shipments to reach 1.5bn units next year, up 19 percent year-on-year. Needless to say, TSMC silicon will power the majority of them.
WD And Sandisk Join Forces
Western Digital and Sandisk have teamed up to create Western Digital’s first hybrid storage device that uses Sandisk’s iSSD and Western Digital’s Caviar Black hard drive.
Western Digital, which has dabbled in solid state disks (SSDs) for the enterprise market, has stayed away from hybrid drives that use relatively small SSDs to act as cache for hard drives. Now the firm has teamed with Sandisk to create its WD Black Solid State Hybrid drives with 500GB capacity.
Western Digital is pitching its hybrid drives at laptop makers, offering units with 5mm, 7mm and 9.5mm heights. The firm said Sandisk’s iSSD uses 19nm NAND flash and claimed it is the world’s “smallest and most advanced semiconductor manufacturing process”, a claim that Intel might question.
Kevin Conley, SVP and GM of client storage solutions at Sandisk said, “By combining SanDisk’s unparalleled flash memory expertise and technology with the hard drive know-how of Western Digital, WD Black SSHDs [solid state hard drives] offer outstanding hard drive-like capacity, and the slim form factor and the level of performance that you will only get with flash memory solutions.”
Seagate was first to introduce hybrid drives with its Momentus XT range, which offers an impressive performance boost over mechanical hard drives for certain workloads. The problem for Western Digital and Seagate is that hybrid drives are merely a stop-gap rather than a long term strategy, with SSD prices falling rapidly due to competition in the SSD industry as opposed to the hard drive industry, where Seagate, Western Digital and Toshiba have a comfortable ride.
Is Non-Volatile Memory The Next Craze?
A report from analysts Yole Developpement claims that MRAM/STTMRAM and PCM will lead the Emerging Non-Volatile Memory (ENVM) market and earn a combined $1.6bn by 2018. If the North Koreans have not conquered America, by 2018 then MRAM/STTMRAM and PCM will surely be the top two ENVM on the market.
Yole’s Yann de Charentenay said that their combined sales will almost double each year, with double-density chips launched every two years. So far we have only had FRAM, PCM and MRAM to play with and they were available in low-density chips to only a few players. The market was quite limited and considerably smaller than the DRAM and flash markets which had combined revenues of $50bn+ in 2012, the report said. In the next five years the scalability and chip density of those memories will be greatly improved and will spark many new applications, says the report.
ENVM will greatly improve the input/output performance of enterprise storage systems whose requirements will intensify with the growing need for web-based data supported by cloud servers, the report said. Mobile phones will increase its adoption of PCM as a substitute to flash NOR memory in MCP packages thanks to 1GB chips made available by Micron in 2012, it added. The next milestone will be the higher-density chips, expected in 2015, will allow access to smart phone applications that are quickly replacing entry-level phones.
TSMC 20nm Processors In High Demand
TSMC believes demand for next-generation 20nm chips will be even higher than demand for current 28nm products.
Speaking in a conference call, TSMC CEO Morris Chang said the volume of 20nm SoCs built next year will be greater than 28nm volume in 2012 and by 2015 it should be greater than 28nm volume in 2013.
TSMC hopes to start 20nm production in the latter part of the year. The company is constructing two new facilities at Fab 15 and it hopes to start 20nm production in both simultaneously. We could be in for a quick ramp.
TSMC will offer only one version of the 20nm process, compared to four versions of the 28nm process. This should also allow it to ramp up volume production faster, reckons Xbit Labs.
TSMC To Boost 28nm Production
TSMC is able to make chips using 28nm process technology at a speedier pace that it originally anticipated. This means that the chipmaker will likely be able to meet demand for existing orders and start accepting new designs.
TSMC promised to increase its 28nm capacity to 68 thousand 300mm wafers per month by the end of the year. It did this by ramping up fab 15/phase 2 to 50,000 300mm wafers a month. According to the Taiwan Economic News it looks like the outfit managed to beat its own projections, which should be good news for customers like AMD, Nvidia and Qualcomm. Well not AMD of course. It just told Globalfoundries to stop making so many of its chips so it can save a bit of money.
But it looks like TSMC is flat out. In November the fab 15/phase 2 processed 52,000 wafers. When combined with fab 15/phase 1, TSMC should be able to process 75 – 80, 000 300mm wafers using 28nm process technologies this month. TSMC produces the majority of 28nm chips at fab 15, which will have capacity of more than 100,000 300mm wafers per month when fully operational.
TSMC Makes Expansion Plans
TSMC is expected to spend $10 billion next year in capital works as Apple plans to contract the outfit to build its next-generation processors.
According to the Chinese-language Economic Daily News TSMC has informed the equipment suppliers of its decision to hike capital expenditure for 2013 to US$10 billion. This indicates that TSMC has overcome technical problem with 20nm process, which Apple’s next-generation processors are said to use.
It also suggests that Jobs’ Mob is speeding up its reduction of work it gives Samsung. Apple has reportedly sent around 200 design engineers to help TSMC get familiar with the company’s next-generation processor designs at TSMC’s facility in Central Taiwan Science Park.
Intel Preparing New SSDs
In addition to the recent price drop for its 320, 330 and 520 series SSDs, Intel is preparing a slight refresh scheduled to launch in Q3 and Q4 2012, according to the recently leaked roadmap at Chinese.VR-Zone.com.
The roadmap kicks off with a rather interesting entry-level 300 series that will apparently get a new 335 series update in Q3 2012. According to the roadmap, the 335 series will initially launch in 240GB capacity and get 80 and 180GB model update in Q1 2013. The new 335 series will most likely still be based on the same SF-2281 controller, be available in 2.5-inch form factor with the SATA 6Gbps interface, and will probably be paired up with a tweaked firmware and a new 20nm NAND flash memory.
Super Talent Outs New SSDs
Super Talent has announced a new line of SATA III SSDs, the Super Talent SuperNova. Aimed at the business market, SuperNova SSDs will be available in 128 and 256GB capcities.
Although it has not announced any details regarding the new SuperNova lineup in its official press release, Super Talent did note that SuperNova features high transfer speeds and “the most secure encryption” on the planet, as well as the proprietary RAISE technology that virtually eliminates unrecoverable read errors.
After some digging around we managed to find that SuperNova is based on Sandforce SF-2200 controller paired up with ONFI Synchronous MLC NAND chips that should provide enterprise level of reliability. The sequential performance is set at 555MB/s read and 525MB/s for write while random 4K performance is at 90K IOPS read and 85K IOPS write, for both 128 and 256GB models.
Adata Outs 40MB/s UHS microSD Card
Adata has launched a 32GB UHS-1 microSD card offering 40MB/s write bandwidth.
Adata, which recently has been making a big push in the solid-state disk (SSD) drive market, has announced its first microSD cards that support the UHS-1 specification. The firm’s Premier Pro cards come in 8GB, 16GB and 32GB capacities with the firm citing read bandwidth of 45MB/s and all important write bandwidth of 40MB/s.
The SD Card Association defined the UHS-I specification as part of its SD Version 3.01 standard, and while Adata’s new cards boast impressive speeds there is a lot of headroom left, with UHS-1 supporting bandwidths up to 104MB/s. Adata’s cards, roughly translated to the ‘X’ speed rating used on a number of memory cards, come out at 266X.
Ray Chu, product manager at Adata said, “These cards have the best read and write performance among all comparable products offered by the industry’s key players. When that is combined with the aggressive pricing options in store for this line, the result is going to be a bonanza for our customers worldwide.”