TSMC Makes Expansion Plans

September 18, 2012 by admin
Filed under Computing

TSMC is expected to spend $10 billion next year in capital works as Apple plans to contract the outfit to build its next-generation processors.

According to the Chinese-language Economic Daily News TSMC has informed the equipment suppliers of its decision to hike capital expenditure for 2013 to US$10 billion. This indicates that TSMC has overcome technical problem with 20nm process, which Apple’s next-generation processors are said to use.

It also suggests that Jobs’ Mob is speeding up its reduction of work it gives Samsung. Apple has reportedly sent around 200 design engineers to help TSMC get familiar with the company’s next-generation processor designs at TSMC’s facility in Central Taiwan Science Park.

Source…

Tags: 10nm chips, central processing units, chip density, chip makers, Chips, clock speed, clock speeds, communications, Computers, conductors, cpu, devices, field programmable gate array, FPGA, handsets, hardware, Intel, laptops, mobile devices, mobile phones, networks, organic polymer substrate, overheating, PC's, Power consumption, processors, research and development, semiconductors, Shang-Yi Chiang, signal delays, silicon stacked performance, smartphones, Software, tablets, Taiwan Semiconductor Manufacturing Co, technology, testing issues, transistors, TSMC, TSMC Expansion Plans, Virtex-7, Virtex-7 485T FPGA, Wireless, wires, Xilinx