TSMC To Boost 28nm Production

December 18, 2012 by admin
Filed under Computing

TSMC is able to make chips using 28nm process technology at a speedier pace that it originally anticipated. This means that the chipmaker will likely be able to meet demand for existing orders and start accepting new designs.

TSMC promised to increase its 28nm capacity to 68 thousand 300mm wafers per month by the end of the year. It did this by ramping up fab 15/phase 2 to 50,000 300mm wafers a month. According to the Taiwan Economic News it looks like the outfit managed to beat its own projections, which should be good news for customers like AMD, Nvidia and Qualcomm. Well not AMD of course. It just told Globalfoundries to stop making so many of its chips so it can save a bit of money.

But it looks like TSMC is flat out. In November the fab 15/phase 2 processed 52,000 wafers. When combined with fab 15/phase 1, TSMC should be able to process 75 – 80, 000 300mm wafers using 28nm process technologies this month. TSMC produces the majority of 28nm chips at fab 15, which will have capacity of more than 100,000 300mm wafers per month when fully operational.

Source…

Tags: 10nm chips, 28nm chip production, central processing units, chip density, chip makers, Chips, clock speed, clock speeds, communications, Computers, conductors, cpu, devices, field programmable gate array, FPGA, handsets, hardware, Intel, laptops, mobile devices, mobile phones, networks, organic polymer substrate, overheating, PC's, Power consumption, processors, research and development, semiconductors, Shang-Yi Chiang, signal delays, silicon stacked performance, smartphones, Software, tablets, Taiwan Semiconductor Manufacturing Co, technology, testing issues, transistors, TSMC, TSMC Expansion Plans, Virtex-7, Virtex-7 485T FPGA, Wireless, wires, Xilinx