Qualcomm is set to unveil its new Snapdragon 820 SoC on August 11 in LA and more details are being leaked than you would see at a Welsh leak recipe contest.
It appears that the new Snapdragon 820 will have the catchy title MSM8996 and it promises some significant performance improvements in key areas. We already know that it will not be catching fire, but it also has a 40 per cent GPU performance increase with its A530 GPU.
The device is also claimed to have a 30 per cent power improvement with 64b of shared virtual memory with the CPU.
Another big area of improvement is the Hydra CPU, which claims a 35 percent improvement compared to the Snapdragon 810.
The Snapdragon 820 will support 4k60 entertainment and high-speed data connectivity.
There are rumours that there will be a QFE3100 Envelope Tracking system this will not speed up mail in the criminally slow Italian Post Office, but should create a lower power and a thermal footprint. A dedicated low power sensor is integrated for always on use.
Another major upgrade compared to the older SoC is a switch from 20nm to 14nm FinFET manufacturing process. We are still expecting the Xiaomi Mi5 to be the first one to use it.
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